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Notice of retraction
Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

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 Sensors and Materials
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Vol. 30 No. 12(2)
Special Issue on Remote Sensing and Sensing Devices

Guest Editor: Haruichi Kanaya (Kyushu University)

Preface

  • Thin films of poly(3,4-ethylenedioxythiophene) (PEDOT) were fabricated via the vapor-phase polymerization (VPP) of the monomer 3,4-ethylenedioxythiophene (EDOT) with FeCl3·6H2O as the oxidant. ... Read More

  • The luminescence spectroscopy of the Al2O3 is widely used for sensing the stress in Al2O3-based materials. One promising approach that improves the spatial resolution of the luminescence spectros ... Read More

  • To replace Al–Ge eutectic bonding, low-temperature direct Cu-to-Cu bonding was developed in this study. Lattice distortion and thus a hardened Cu subsurface conducted by air plasma bombardment ... Read More

  • In this paper, hermetic packaging using room-temperature (RT) Cu–Cu bonding is demonstrated for microsystem packaging. The bonding of the compliant rim made of Cu to electroplated Cu was perfo ... Read More

  • Fine cone-shaped bumps (6 µm) were fabricated by a nanoparticle deposition method, where the nanoparticles were deposited onto hole patterns defined in a photoresist. In this work, the goal is ... Read More

  • We describe microgravity generation and the resolution evaluation results of a sub-1-mG microelectromechanical system (MEMS) accelerometer (1 G = 9.8 m/s2). To realize input acceleration below 1 ... Read More

  • Remote sensing has been providing solutions in a variety of sectors as a result of the recent growth in technology and available data. Land cover mapping is the most widely used application of r ... Read More

  • In this paper, an antenna sensor for a radio-wave-type endoscope to detect a blood vessel in fatty tissue is proposed. The antenna sensor consists of one transmitting antenna and two receiving a ... Read More

  • With the recent spread of the Internet of Things (IoT), smart devices are equipped with a number of sensors to collect data necessary for various applications. A wake-up radio (WUR) is considere ... Read More

  • We present a highly efficient power amplifier (PA) with an impedance-matched planar antenna. An impedance-matching network including inductors and capacitors is a common and essential practice f ... Read More


S&M1724

Research Paper of Special Issue

S&M1724
In situ Monitoring of Vapor-phase Polymerization and Characterization of Poly(3,4-ethylenedioxythiophene) Thin Films
Yasuko Koshiba, Mana Hirai, Shohei Horike, Masahiro Morimoto, Masahiro Misaki, Tastuya Fukushima, and Kenji Ishida
pp. 2873-2879
https://doi.org/10.18494/SAM.2018.1986
Published on December 18, 2018
PDF (open access)

S&M1725

Research Paper of Special Issue

S&M1725
Asymmetric Line Shape of Near-field Luminescence Spectrum Induced by Stress in Al2O3
Toru Tomimatsu and Ryo Takigawa
pp. 2881-2888
https://doi.org/10.18494/SAM.2018.2019
Published on December 18, 2018
PDF (open access)

S&M1726

Research Paper of Special Issue

S&M1726
Stress-enhanced Cu-to-Cu Bonding for MEMS Packaging
Jenn-Ming Song, Sin-Yong Liang, Zong-Yu Xie, Po-Hao Chiang, Shang-Kun Huang, Ying-Ta Chiu, David Tarng, Chih-Pin Hung, and Jing-Yuan Lin
pp. 2889-2895
https://doi.org/10.18494/SAM.2018.1948
Published on December 18, 2018
PDF (open access)

S&M1727

Research Paper of Special Issue

S&M1727
Room-temperature Hermetic Packaging Using Ultrasonic Cu–Cu Bonding with Compliant Rim
Ryo Takigawa, Keiichiro Iwanabe, Akihiro Ikeda, Takayuki Takao, and Tanemasa Asano
pp. 2897-2903
https://doi.org/10.18494/SAM.2018.1967
Published on December 18, 2018
PDF (open access)

S&M1728

Research Paper of Special Issue

S&M1728
Fine Cone-shaped Bumps for Three-dimensional LSI Package—An Optimization of Thermocompression Bonding Process
Shunsuke Nemoto, Ying Ying Lim, Hiroshi Nakagawa, Katsuya Kikuchi, and Masahiro Aoyagi
pp. 2905-2917
https://doi.org/10.18494/SAM.2018.2009
Published on December 18, 2018
PDF (open access)

S&M1729

Research Paper of Special Issue

S&M1729
Microgravity Generation Using Tilting Board for Resolution Evaluation of MEMS Accelerometer
Motohiro Takayasu, Ippei Tsuji, Hiroyuki Ito, Daisuke Yamane, Shiro Dosho, Toshifumi Konishi, Noboru Ishihara, Katsuyuki Machida, and Kazuya Masu
pp. 2919-2926
https://doi.org/10.18494/SAM.2018.1840
Published on December 18, 2018
PDF (open access)

S&M1730

Research Paper of Special Issue

S&M1730
Exploring Land Cover Classification Accuracy of Landsat 8 Image Using Spectral Index Layer Stacking in Hilly Region of South Korea
Jae Kang Lee, Tri Dev Acharya, and Dong Ha Lee
pp. 2927-2941
https://doi.org/10.18494/SAM.2018.1934
Published on December 18, 2018
PDF (open access)

S&M1731

Research Paper of Special Issue

S&M1731
Antenna Sensor for Radio-wave-type Endoscope
Takafumi Fujimoto, Keiya Kawashima, Genki Horiguchi, and Toshiyuki Tanaka
pp. 2943-2959
https://doi.org/10.18494/SAM.2018.1965
Published on December 18, 2018
PDF (open access)

S&M1732

Research Paper of Special Issue

S&M1732
Wake-up Radio-resilient Scanning Mechanism for Mobile Device in IEEE 802.11ba
Hyunhee Park and Eui-Jik Kim
pp. 2961-2968
https://doi.org/10.18494/SAM.2018.1961
Published on December 18, 2018
PDF (open access)

S&M1733

Research Paper of Special Issue

S&M1733
Impedance-matched Planar-antenna-integrated High-efficiency Push-pull Power Amplifier with Center-tapped Transformer for 5 GHz Wireless Communication
Takeshi Kuboki, Tomoki Sadakiyo, Wee Sang Park, and Haruichi Kanaya
pp. 2969-2978
https://doi.org/10.18494/SAM.2018.2025
Published on December 18, 2018
PDF (open access)

Cover of this Issue





Forthcoming Regular Issues


Forthcoming Special Issues

Applications of Novel Sensors and Related Technologies for Internet of Things
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Cheng-Fu Yang (National University of Kaohsiung)
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Special Issue on Advanced Sensing Technologies and Their Applications in Human/Animal Activity Recognition and Behavior Understanding
Guest editor, Kaori Fujinami (Tokyo University of Agriculture and Technology)
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Special Issue on International Conference on Biosensors, Bioelectronics, Biomedical Devices, BioMEMS/NEMS and Applications 2023 (Bio4Apps 2023)
Guest editor, Dzung Viet Dao (Griffith University) and Cong Thanh Nguyen (Griffith University)
Conference website
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Special Issue on Piezoelectric Thin Films and Piezoelectric MEMS
Guest editor, Isaku Kanno (Kobe University)
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Special Issue on Advanced Micro/Nanomaterials for Various Sensor Applications (Selected Papers from ICASI 2024)
Guest editor, Sheng-Joue Young (National United University)
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Special Issue on Asia-Pacific Conference of Transducers and Micro-Nano Technology 2024 (APCOT 2024)
Guest editor, Guangya ZHOU (National University of Singapore) and Chengkuo LEE (National University of Singapore)
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