S&M470 Research Paper
On-Chip Near-Field Electromagnetic Shielding Effect of Electroplated Copper Layers [PDF]
Tae Goo Kang and Young-Ho Cho
Keywords: microwave transceiver, near-field electromagnetic shielding, on-chip shielding packaging, multi-chip microsystems, electroplated copper
Near-field electromagnetic loss of electroplated copper layers has been characterized for applications to multichip microsystems with on-chip electromagnetic protection. Copper layers in the thickness range of 0.2 μm-200 μm have been electroplated on Pyrex glass substrates. A pair of microwave transceivers 3.5 mm x 3.5 mm in size has been fabricated using electroplated nickel microloop antennas. An electromagnetic radiation loss of 10 dB-40 dB has been measured from the copper layers in the thickness range of 0.2 μm-200 μm for the wave bandwidth of 100 MHz - 1 GHz. The 0.2-μm-thick copper layer provides a shield loss of 20 dB at frequencies higher than 300 MHz while showing a predominant decrease of shield loss to the 10 dB level at lower frequencies. No substantial increase of shield effectiveness has been observed for copper shield layers thicker than 2 μm.
Cite this article
Tae Goo Kang and Young-Ho Cho, On-Chip Near-Field Electromagnetic Shielding Effect of Electroplated Copper Layers, Sens. Mater., Vol. 14, No. 2, 2002, p. 57-66.