We present a fabrication method for a high-aspect-ratio 100-nm-scale nickel stamper using e-beam writing on a chrome/quartz mask for the injection molding of optical grating patterns. We suggest a new fabrication process for a 100-nm-scale nickel stamper which uses a chrome layer on a blank mask as a seed layer for the nickel electroplating process. A conventional blank mask consists of layers in the order of Photoresist (PR), CrON and Cr on a quartz substrate (PR/CrON/Cr/Qz). We have prepared a blank mask without an antireflection layer of CrON, which is a nonconductive material, in order to use the chrome layer as a seed layer for the electroplating process. In PR mold fabrication, we have determined an optimum e-beam dosage of 10 C/cm2 for the PR/CrON/Cr/Qz mask, and one of 8.5 C/cm2 for the PR/Cr/Qz mask. The fabricated PR mold on the PR/CrON/Cr/Qz mask showed a minimum line width of 84 nm and the PR mold on the PR/Cr/Qz mask showed one of 96 nm with a height of 30010 nm. We have deposited additional seed layer materials of Ni as thick as 100 nm due to the high electric resistance of the Cr layer of 100 . After the nickel electroplating process, the total thickness of the fabricated nickel stamper was approximately 33020 m. The minimum width and height of the fabricated nickel line were measured as 1166 nm and 24020 nm, respectively. Consequently, we have fabricated a 2.5-AR (Aspect Ratio) nickel stamper with a minimum width of 1166 nm. The fabricated 100-nm-scale nickel stamper showed a maximum error of 20 nm compared with the PR mold.