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Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
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Sensors and Materials, Volume 30, Number 1 (2018)
Copyright(C) MYU K.K.
pp. 101-109
S&M1476 Research Paper
https://doi.org/10.18494/SAM.2018.1632
Published: January 12, 2018

Displacement Measurement Realized by Near-field Coupling between Multiple Coils [PDF]

Shujing Su, Lei Zhang, Yanjie Guo, Fei Lu, Qiulin Tan, and Jijun Xiong

(Received May 22, 2017; Accepted August 8, 2017)

Keywords: displacement sensing, near-field coupling, ADS simulation, coupling model, tentative experiment

A displacement-sensing scheme is presented herein by utilizing near-field coupling between multiple coils. The sensing system consists of the stationary part and removable sensor tag. The change in the relative position between the stationary part and the sensor tag can result in the variation of characteristic frequencies, which can be retrieved from the impedance of the reader antenna on the side of the stationary part. The lumped model of the system is established for theoretical analysis, and the results of the analysis were verified by electromagnetic simulation. A prototype of the system was fabricated by printed circuit board (PCB) technology to carry out tentative experiments, the results of which were used to verify the findings of the theoretical analysis and simulation. The results of the experiment conducted in the lab demonstrated that the sensor is capable of the contactless measurement of displacement from 3 to 10 mm with a considerable average sensitivity of 1.5 MHz/mm.

Corresponding author: Qiulin Tan


Cite this article
Shujing Su, Lei Zhang, Yanjie Guo, Fei Lu, Qiulin Tan, and Jijun Xiong, Displacement Measurement Realized by Near-field Coupling between Multiple Coils, Sens. Mater., Vol. 30, No. 1, 2018, p. 101-109.



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