With the development of low-power-consumption electronic devices and systems, the development of power supplies will be a major challenge. High-performance piezoelectric energy harvesters (PEHs) are an alternative that convert mechanical deformation into electric charge. For PEHs, it is highly desirable to utilize materials with a high piezoelectric charge coefficient. Piezoelectric thick films based on bonding and thinning technologies meet this requirement due to their high-temperature sintering process. In this paper we review the development of piezoelectric thick film fabrication processes, including the direct bonding process and the transferring process. Additionally, PEHs in substrates for different applications are described. Moreover, we summarize and compare the output performance of thick-film-based PEHs from all recently published papers in terms of normalized power density and resonant frequency.