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Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
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Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.
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Sensors and Materials
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is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.
Instructions to authors
English 日本語
Instructions for manuscript preparation
English 日本語
Template
English
Publisher
MYU K.K.
Sensors and Materials
1-23-3-303 Sendagi,
Bunkyo-ku, Tokyo 113-0022, Japan
Tel: 81-3-3827-8549
Fax: 81-3-3827-8547
MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.
MYU Research
(proofreading and recording)
MYU K.K.
(translation service)
The Art of Writing Scientific Papers
(How to write scientific papers)
(Japanese Only)
Sensors and Materials, Volume 30, Number 12(2) (2018)
Copyright(C) MYU K.K.
Copyright(C) MYU K.K.
|
pp. 2897-2903
S&M1727 Research Paper of Special Issue https://doi.org/10.18494/SAM.2018.1967 Published: December 18, 2018 Room-temperature Hermetic Packaging Using Ultrasonic Cu–Cu Bonding with Compliant Rim [PDF] Ryo Takigawa, Keiichiro Iwanabe, Akihiro Ikeda, Takayuki Takao, and Tanemasa Asano (Received April 23, 2018; Accepted July 4, 2018) Keywords: hermetic packaging, compliant rim, room-temperature Cu–Cu bonding, ultrasonic bonding, MEMS packaging
In this paper, hermetic packaging using room-temperature (RT) Cu–Cu bonding is demonstrated for microsystem packaging. The bonding of the compliant rim made of Cu to electroplated Cu was performed with ultrasonic assist at RT. Owing to the cone-shaped cross section of the compliant rim, it easily deforms under pressing load with ultrasonic assist and bonds to the counter Cu film at RT. As a result of a simple vacuum test, the air leak rate of the cavity inside the bonded sample was approximately 2 × 10−11 Pa·m3/s, which may be sufficiently low for applications of vacuum packaging of microdevices.
Corresponding author: Ryo Takigawa Cite this article Ryo Takigawa, Keiichiro Iwanabe, Akihiro Ikeda, Takayuki Takao, and Tanemasa Asano, Room-temperature Hermetic Packaging Using Ultrasonic Cu–Cu Bonding with Compliant Rim, Sens. Mater., Vol. 30, No. 12, 2018, p. 2897-2903. |
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