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Vol. 34, No. 8(3), S&M3042

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Vol. 32, No. 8(2), S&M2292

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Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
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Sensors and Materials, Volume 31, Number 7(2) (2019)
Copyright(C) MYU K.K.
pp. 2271-2279
S&M1930 Research Paper of Special Issue
https://doi.org/10.18494/SAM.2019.2305
Published in advance: June 11, 2019
Published: July 19, 2019

Vertical Hot-electron Terahertz Detectors Based on Black-As1−xPx/graphene/black-As1−yPy Heterostructures [PDF]

Maxim Ryzhii, Victor Ryzhii, Vladimir Mitin, Michael S. Shur, and Taiichi Otsuji

(Received January 21, 2019; Accepted April 5, 2019)

Keywords: hot electron, terahertz, photodetector, graphene, black arsenic, black phosphorus, heterostructure

We propose and evaluate vertical hot-electron terahertz (THz) detectors based on black-As1−xPx/graphene/black-As1−yPy (b-AsP/G/b-AsP) heterostructures. The operation of these detectors is associated with the thermionic emission of the electrons heated in the graphene layer (G-layer) by incoming THz radiation stimulating the electron injection from the emitter, i.e., with the hot-electron bolometric mechanism. The combination of the effective electron heating in the G-layer with the features of the b-As1−xPx and b-As1−yPy band structures with a proper relation between the b-P fractions, x and y (x ≥ y), might result in the high photoconductive gain and detector responsivity of the proposed detectors. As discussed, these detectors can surpass the similar bolometric detectors based on graphene-based heterostructures with relatively high energy barriers for the electrons and holes in the G-layers and the bolometric detectors based on III-V quantum wells.

Corresponding author: Victor Ryzhii


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Cite this article
Maxim Ryzhii, Victor Ryzhii, Vladimir Mitin, Michael S. Shur, and Taiichi Otsuji, Vertical Hot-electron Terahertz Detectors Based on Black-As1−xPx/graphene/black-As1−yPy Heterostructures, Sens. Mater., Vol. 31, No. 7, 2019, p. 2271-2279.



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