Young Researcher Paper Award 2023
🥇Winners

Notice of retraction
Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

Instructions to authors
English    日本語

Instructions for manuscript preparation
English    日本語

Template
English

Publisher
 MYU K.K.
 Sensors and Materials
 1-23-3-303 Sendagi,
 Bunkyo-ku, Tokyo 113-0022, Japan
 Tel: 81-3-3827-8549
 Fax: 81-3-3827-8547

MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.


MYU Research

(proofreading and recording)


MYU K.K.
(translation service)


The Art of Writing Scientific Papers

(How to write scientific papers)
(Japanese Only)

Sensors and Materials, Volume 33, Number 10(2) (2021)
Copyright(C) MYU K.K.
pp. 3563-3580
S&M2709 Research Paper of Special Issue
https://doi.org/10.18494/SAM.2021.3581
Published: October 20, 2021

Experimental and Simulation Analysis of Effect of Fillet Radius of Micro Square Hole on Copper Sheets in Deep Drawing of Sheets [PDF]

Tsung-Chia Chen, Ching-Min Hsu, and Cheng-Chi Wang

(Received May 15, 2021; Accepted August 19, 2021)

Keywords: micro deep drawing, springback, copper, material deformation history

In the design and fabrication of molds in the deep drawing process, the gap between the punch and the mold is extremely small. Obtaining a product of the correct size and shape necessitates the control of certain variables in the process, consideration of the problems of springback after load removal and the occurrence of cracks in the drawing process, and the estimation of the punch load. In this study, we focused on copper sheets and considered the influence of the scale effect and fillet radius of a micro square hole on thin sheets on the basis of an updated Lagrangian formulation (ULF) and finite element analysis. Sheet behavior was simulated using a micro-elastoplastic material model, the performance of which was compared with that of models involving conventional materials. Subsequently, the Dynaform LS-DYNA solver was used for simulation analysis, and pre- and post-processing were carried out to obtain the material deformation history, as well as to determine the thickness change distribution and material stress and prepare strain distribution maps. It was found that the scale effect of the sheet thickness influences the relation between the punch load and stroke, the distribution of thickness, the distribution of stress and strain, the maximum diameter of the flange hole, and the maximum flange height. Finally, the simulation results were compared with experimental results to confirm the accuracy of 3D finite element analysis of the elastoplastic deformation. The results show the influence of the fillet radius of the inner hole (Br) for copper sheets on the drawing process: the punch load increases with increasing Br, but the minimum thickness of the formed flange decreases as Br increases. The maximum principal stress/strain and the flange height increase as Br increases. The findings serve as a valuable reference for the design and processing of micro deep drawing.

Corresponding author: Cheng-Chi Wang


Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 International License.

Cite this article
Tsung-Chia Chen, Ching-Min Hsu, and Cheng-Chi Wang, Experimental and Simulation Analysis of Effect of Fillet Radius of Micro Square Hole on Copper Sheets in Deep Drawing of Sheets, Sens. Mater., Vol. 33, No. 10, 2021, p. 3563-3580.



Forthcoming Regular Issues


Forthcoming Special Issues

Special Issue on Applications of Novel Sensors and Related Technologies for Internet of Things
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Cheng-Fu Yang (National University of Kaohsiung)
Call for paper


Special Issue on Advanced Sensing Technologies for Green Energy
Guest editor, Yong Zhu (Griffith University)
Call for paper


Special Issue on Room-temperature-operation Solid-state Radiation Detectors
Guest editor, Toru Aoki (Shizuoka University)
Call for paper


Special Issue on International Conference on Biosensors, Bioelectronics, Biomedical Devices, BioMEMS/NEMS and Applications 2023 (Bio4Apps 2023)
Guest editor, Dzung Viet Dao (Griffith University) and Cong Thanh Nguyen (Griffith University)
Conference website
Call for paper


Special Issue on Advanced Sensing Technologies and Their Applications in Human/Animal Activity Recognition and Behavior Understanding
Guest editor, Kaori Fujinami (Tokyo University of Agriculture and Technology)
Call for paper


Special Issue on Signal Collection, Processing, and System Integration in Automation Applications
Guest editor, Hsiung-Cheng Lin (National Chin-Yi University of Technology)
Call for paper


Copyright(C) MYU K.K. All Rights Reserved.