pp. 37-45
S&M2791 Research Paper https://doi.org/10.18494/SAM3747 Published: January 20, 2022 Microfabrication of Si by KOH Etchant Using Etching Mask Amorphized by Ar Ion Beam [PDF] Mina Sato, Mie Tohnishi, and Akihiro Matsutani (Received November 26, 2021; Accepted December 28, 2021) Keywords: Si, amorphous, KOH, wet chemical etching, ion beam, microfabrication
We demonstrate the microfabrication of Si by KOH wet etching using a mask pattern amorphized by an ion beam as an etching mask. An electron cyclotron resonance ion shower system was used as an ion beam source of 100 to 1000 eV energy. We succeeded in fabricating an etching mask that can etch a Si (110) substrate wafer to a depth of 3.7 µm by amorphizing the Si surface at an ion energy of 400 eV. In addition, we made microfluidic devices and single-cell isolation chips using the proposed microfabrication technique. We believe that the proposed technique will be useful for the microfabrication of Si-based microfluidic devices and biochips.
Corresponding author: Mina SatoThis work is licensed under a Creative Commons Attribution 4.0 International License. Cite this article Mina Sato, Mie Tohnishi, and Akihiro Matsutani, Microfabrication of Si by KOH Etchant Using Etching Mask Amorphized by Ar Ion Beam, Sens. Mater., Vol. 34, No. 1, 2022, p. 37-45. |