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Notice of retraction
Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
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Sensors and Materials, Volume 20, Number 1 (2008)
Copyright(C) MYU K.K.
pp. 45-53
S&M704 Research Paper
https://doi.org/10.18494/SAM.2008.507
Published: February 29, 2008

Nickel Microneedles Fabricated by Sequential Copper and Nickel Electroless Plating and Copper Chemical Wet Etching [PDF]

Phill Gu Jung, Tae Won Lee, Dong Joon Oh, Sung Jin Hwang, Im Deok Jung, Sang Min Lee and Jong Soo Ko

(Received July 30, 2007; Accepted October 16, 2007)

Keywords: microneedle, electroless plating, chemical etching

Nickel microneedles have been fabricated by a sequential process of electroless copper and nickel plating and copper wet chemical etching. An electroless plating solution was injected using an external syringe pump and made to flow through the inside of a copper base tube. The temperature gradient along the length of the copper base tube brings about different plating thicknesses along its length, resulting in a wide inlet and a sharp end with a microaperture. The diameter of the microaperture could be readily controlled by plating time such that microneedles with various diameters could be easily acquired. To verify their applicability, the fabricated microneedles have been applied to a probe for cell capturing and to a needle for microdispensing.

Corresponding author: Jong Soo Ko


Cite this article
Phill Gu Jung, Tae Won Lee, Dong Joon Oh, Sung Jin Hwang, Im Deok Jung, Sang Min Lee and Jong Soo Ko, Nickel Microneedles Fabricated by Sequential Copper and Nickel Electroless Plating and Copper Chemical Wet Etching, Sens. Mater., Vol. 20, No. 1, 2008, p. 45-53.

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