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Vol. 34, No. 8(3), S&M3042

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Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

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Sensors and Materials, Volume 36, Number 9(1) (2024)
Copyright(C) MYU K.K.
pp. 3663-3676
S&M3757 Research Paper
https://doi.org/10.18494/SAM5124
Published: September 2, 2024

Effect of Electrode Material on Sensing Performance of MEMS-based Pyroelectric Sensors [PDF]

Zhen Xiong, Chia-Yu Tsai, and Chia-Yen Lee

(Received May 1, 2024; Accepted July 17, 2024)

Keywords: infrared sensor, pyroelectric effect, response voltage, ZnO thin film

MEMS technology is employed to fabricate human infrared sensors on double-sided polished glass substrates. For each device, the sensing layer consists of a thin ZnO film deposited on the lower electrode by RF magnetron sputtering. The top electrode was deposited by an electron beam evaporation method with the same material as that used for the bottom electrode. Numerical and experimental investigations were performed to examine the effects of five different electrode materials (Cr, Cu, Au, Pt, and Ag) on the sensing performance of the fabricated device. The experimental results showed that the use of Ag as the electrode material results in the highest response voltage (23 mV/mW) at a chopping frequency of 60 Hz. Additionally, the simulation results showed that the Ag electrodes yield the fastest temperature response. For all the electrode materials, the temperature-time change rate of the sensing layer was positively correlated with the voltage response of the sensor chip.

Corresponding author: Chia-Yen Lee


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Cite this article
Zhen Xiong, Chia-Yu Tsai, and Chia-Yen Lee, Effect of Electrode Material on Sensing Performance of MEMS-based Pyroelectric Sensors, Sens. Mater., Vol. 36, No. 9, 2024, p. 3663-3676.



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