pp. 5299-5307
S&M3868 Research Paper of Special Issue https://doi.org/10.18494/SAM5270 Published: December 20, 2024 Data Analyses of Structural Parameters Impacting the Sensing Characteristics of Single-axis Accelerometers [PDF] Shang-Te Tsai, Shao-Jun Luo, Rui-Zhi Shi, Cheng-Fu Yang, and Kao-Wei Min (Received August 5, 2024; Accepted December 9, 2024) Keywords: structural parameter, sense characteristic, COMSOL multiphysics, von Mises stress, differential capacitive bridge accelerometer
In this study, we utilized COMSOL Multiphysics® (version 6.0) finite element software to conduct simulations on accelerometers with varying structural parameters. The data analyses of structural parameters considered included accelerations of 25, 50, and 75 g, and variations in the thicknesses of the mass block, electrodes (both movable and external fixed comb electrodes), and spring elements, ranging from 0.5 to 10 μm. Our analysis focused on evaluating the impacts of these parameter changes on several key metrics: sense voltages, displacements, and maximum von Mises stresses within the accelerometer structure. By systematically altering acceleration levels and the geometrical dimensions of the accelerometer components, we aimed to discern how these variations affect the device performance characteristics. This approach enabled us to gain insights into the structural behavior of the accelerometers under different operational conditions and provided valuable data for optimizing their design and functionality in practical applications. The results obtained from these simulations contribute to advancing the understanding and development of high-performance accelerometer technologies.
Corresponding author: Cheng-Fu Yang and Kao-Wei MinThis work is licensed under a Creative Commons Attribution 4.0 International License. Cite this article Shang-Te Tsai, Shao-Jun Luo, Rui-Zhi Shi, Cheng-Fu Yang, and Kao-Wei Min, Data Analyses of Structural Parameters Impacting the Sensing Characteristics of Single-axis Accelerometers, Sens. Mater., Vol. 36, No. 12, 2024, p. 5299-5307. |