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Vol. 32, No. 8(2), S&M2292

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Sensors and Materials, Volume 37, Number 3(2) (2025)
Copyright(C) MYU K.K.
pp. 943-953
S&M3967 Research Paper
https://doi.org/10.18494/SAM5404
Published: March 14, 2025

Microfabrication of Black Ge by SF6/O2- and C4F8-based Deep Reactive Ion Etching [PDF]

Mie Tohnishi, Sachiko Matsushita, and Akihiro Matsutani

(Received October 21, 2024; Accepted January 22, 2025)

Keywords: microfabrication, black Ge, deep RIE, regular reflectance, emissivity

We fabricated black Ge with numerous needlelike microstructures by SF6/O2- and C4F8-based deep reactive ion etching and measured the regular reflectance in the ultraviolet-to-near-infrared range, thermal radiation properties, and electrical resistance for electrode applications. The regular reflectance of black Ge was very low in the range of 250 nm–2.5 μm. The emissivity of the black Ge surface was observed to be the same as that of a carbon plate. We found that the scallops on the sidewalls of the microstructures also contributed to the low reflectance. Furthermore, the black Ge electrode had a lower resistance than a planar Ge electrode. The black Ge electrode, which has an increased surface area of ​Ge with numerous needlelike microstructures, has high emissivity, antireflectivity and low resistance, and we consider that it is useful for application to device fabrication utilizing these properties.

Corresponding author: Mie Tohnishi


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Cite this article
Mie Tohnishi, Sachiko Matsushita, and Akihiro Matsutani, Microfabrication of Black Ge by SF6/O2- and C4F8-based Deep Reactive Ion Etching, Sens. Mater., Vol. 37, No. 3, 2025, p. 943-953.



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