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Notice of retraction
Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

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Sensors and Materials, Volume 22, Number 8 (2010)
Copyright(C) MYU K.K.
pp. 409-416
S&M820 Research Paper
https://doi.org/10.18494/SAM.2010.633
Published: December 17, 2010

Preparation and Performance of Nickel Oxide Films by Ion Beam Sputtering Deposition and Oxidation Annealing [PDF]

Jing Peng, Zhimou Xu, Shangbao Wang, Quanlin Jie and Cunhua Chen

(Received August 11, 2009; Accepted February 5, 2010)

Keywords: nickel oxide thin films, ion beam sputtering, oxidation annealing, microstructure

Polycrystalline NiOx thin films were deposited on quartz substrates by ion beam sputter deposition and oxidation annealing at high temperatures. X-ray diffraction (XRD) and scanning electron microscopy (SEM) morphologies indicate that the as-deposited nickel oxide thin films are flat amorphous nickel or oxides. However, they developed into semiconducting NiOx thin films during the oxidation annealing process. Four-point probe tests confirmed their sheet resistance and the resistance-temperature relationship. In addition, infrared (IR) measurements were also carried out in the visible spectrum range to study the optical properties of the as-deposited and annealed films. Apparently, the NiOx films obtained by the new method exihibit properties that are comparable to those of the films formed by other methods. The thin films have potential application as gas sensors.

Corresponding author: Zhimou Xu


Cite this article
Jing Peng, Zhimou Xu, Shangbao Wang, Quanlin Jie and Cunhua Chen, Preparation and Performance of Nickel Oxide Films by Ion Beam Sputtering Deposition and Oxidation Annealing, Sens. Mater., Vol. 22, No. 8, 2010, p. 409-416.



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