Young Researcher Paper Award 2025
🥇Winners

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

Instructions to authors
English    日本語

Instructions for manuscript preparation
English    日本語

Template
English

Publisher
 MYU K.K.
 Sensors and Materials
 1-23-3-303 Sendagi,
 Bunkyo-ku, Tokyo 113-0022, Japan
 Tel: 81-3-3827-8549
 Fax: 81-3-3827-8547

MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.


MYU Research

(proofreading and recording)


MYU K.K.
(translation service)


The Art of Writing Scientific Papers

(How to write scientific papers)
(Japanese Only)

Sensors and Materials, Volume 38, Number 10(4) (2026)
Copyright(C) MYU K.K.
pp. 6183-6194
S&M4674 Research Paper
https://doi.org/10.18494/SAM6340
Published: October 30, 2026

Eco-friendly Corn-husk-based Natural-Fiber Composite Panels: Thermal, Acoustic, and Light-induced Degradation Behavior for Sustainable Engineering Applications [PDF]

Dieter Rahmadiawan, Shih-Chen Shi, Yu Hao, and Guan-Yu Chen

(Received March 16, 2026; Accepted July 27, 2026)

Keywords: corn‑husk plywood, thermal insulation, sound absorption, photodegradation, sustainable materials

In this study, we explore the thermal, acoustic, and photodegradation properties of eco-friendly corn-husk plywood of various densities (600, 800, and 1000 kg/m³) and thicknesses (3, 5, and 10 mm). Thermal tests showed that lower density increased internal porosity, reducing thermal conductivity. Acoustic measurements in a small reverberation chamber revealed that sound absorption improved with lower density and greater thickness. The 10‑600 (thickness-density) sample achieved a peak absorption coefficient of 0.41 at 6300 Hz and an average coefficient of 0.308, exceeding the 0.200 benchmark for effective sound‑absorbing materials. Photodegradation under 28 days of UV‑A and visible light exposure led to a 60% decrease in tensile strength and 8.2% weight loss. X-ray photoelectron spectroscopy analysis showed a reduction in C1s (87.3 to 72.8%) and an increase in O1s (12.7 to 27.2%), indicating cellulose oxidation and chain scission. These results demonstrate that low‑density corn‑husk plywood combines strong thermal and acoustic performance with inherent photodegradability, making it a promising sustainable building material.

Corresponding author: Shih-Chen Shi


Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 International License.

Cite this article
Dieter Rahmadiawan, Shih-Chen Shi, Yu Hao, and Guan-Yu Chen, Eco-friendly Corn-husk-based Natural-Fiber Composite Panels: Thermal, Acoustic, and Light-induced Degradation Behavior for Sustainable Engineering Applications, Sens. Mater., Vol. 38, No. 10, 2026, p. 6183-6194.



Forthcoming Regular Issues


Forthcoming Special Issues

Special Issue on Signal Collection, Processing, and System Integration in Automation Applications 2026
Guest editor, Hsiung-Cheng Lin (National Chin-Yi University of Technology), Ming-Te Chen (National Chin-Yi University of Technology), and Chin-Yi Cheng (National Yunlin University of Science and Technology)
Call for paper


Special Issue on Converging Smart Materials, Artificial Intelligence, and Quantum Technologies for Intelligent Sensing and Future Electronics
Guest editor, Prof. Wipoo Sriseubsai (King Mongkut’s Institute of Technology Ladkrabang)
Call for paper


Special Issue on Emerging Trends in Advanced Sensor Applications
Guest editor, Shih-Chen Shi (National Cheng Kung University) and Tao-Hsing Chen (National Kaohsiung University of Science and Technology)
Call for paper


Special Issue on Sensing Beyond Transduction: Materials, Devices, and Signal Processing for Intelligent Sensory Systems
Guest editor, Masayuki Sohgawa (Niigata University)
Call for paper


Special Issue on Advanced Materials and Technologies for Sensor and Artificial- Intelligence-of-Things Applications (Selected Papers from ICASI 2026)
Guest editor, Sheng-Joue Young (National Yunlin University of Science and Technology)
Conference website
Call for paper


Special Issue on Biosensing Devices
Guest editor, Kiyotaka Sasagawa (Nara Institute of Science and Technology)
Call for paper


Copyright(C) MYU K.K. All Rights Reserved.