Young Researcher Paper Award 2025
🥇Winners

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

Instructions to authors
English    日本語

Instructions for manuscript preparation
English    日本語

Template
English

Publisher
 MYU K.K.
 Sensors and Materials
 1-23-3-303 Sendagi,
 Bunkyo-ku, Tokyo 113-0022, Japan
 Tel: 81-3-3827-8549
 Fax: 81-3-3827-8547

MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.


MYU Research

(proofreading and recording)


MYU K.K.
(translation service)


The Art of Writing Scientific Papers

(How to write scientific papers)
(Japanese Only)

Sensors and Materials, Volume 38, Number 8(3) (2026)
Copyright(C) MYU K.K.
pp. 4599-4620
S&M4584 Report (A)
https://doi.org/10.18494/SAM6413
Published: August 27, 2026

Spatiotemporal Thermal Fault Prediction for Electromechanical Equipment Using High-density Sensor Arrays and Attention-enhanced Algorithm [PDF]

Xuemei Yu, Feifei Xing, Bingtao Liu, Nan Zhang, and Jie Zhu

(Received May 11, 2026; Accepted August 4, 2026)

Keywords: thermal fault prediction, temperature sensor array, building electromechanical equipment, mathematical model

The stable operation of electromechanical equipment is vital for modern infrastructure. However, thermal faults remain a leading cause of unexpected shutdowns. Traditional single‑point monitoring and infrared (IR) inspections often fail to detect incipient, localized anomalies owing to limited timeliness and spatial resolution. Therefore, we developed a predictive system based on high‑density temperature sensor arrays and advanced spatiotemporal modeling. In the system, an optimized 64‑channel Class A PT100 resistance temperature detector topology with MAX31865 converters was deployed to capture dynamic thermal fields. A complete preprocessing pipeline, including denoising and feature engineering, ensured data integrity by suppressing stochastic hardware noise. The prediction model was established by integrating convolutional long short‑term memory (ConvLSTM) with a convolutional block attention module (CBAM), focusing on critical spatial regions. Quantile regression analysis was used for probabilistic fault estimation and a multi‑level warning system. The validation results of the system performance on a 75 kW pump for three months demonstrated that the ConvLSTM + CBAM model showed a mean absolute error of 0.50 °C, a 23% improvement over the ConvLSTM model. The model extended the average fault warning lead time to 52 min, representing a 150% increase compared with that of the LSTM model. These results show that dense sensor arrays combined with attention‑based deep learning deliver accurate thermal diagnostics comparable to IR imaging, offering a scalable solution for proactive industrial maintenance.

Corresponding author: Xuemei Yu


Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 International License.

Cite this article
Xuemei Yu, Feifei Xing, Bingtao Liu, Nan Zhang, and Jie Zhu, Spatiotemporal Thermal Fault Prediction for Electromechanical Equipment Using High-density Sensor Arrays and Attention-enhanced Algorithm, Sens. Mater., Vol. 38, No. 8, 2026, p. 4599-4620.



Forthcoming Regular Issues


Forthcoming Special Issues

Special Issue on Signal Collection, Processing, and System Integration in Automation Applications 2026
Guest editor, Hsiung-Cheng Lin (National Chin-Yi University of Technology), Ming-Te Chen (National Chin-Yi University of Technology), and Chin-Yi Cheng (National Yunlin University of Science and Technology)
Call for paper


Special Issue on Converging Smart Materials, Artificial Intelligence, and Quantum Technologies for Intelligent Sensing and Future Electronics
Guest editor, Prof. Wipoo Sriseubsai (King Mongkut’s Institute of Technology Ladkrabang)
Call for paper


Special Issue on Emerging Trends in Advanced Sensor Applications
Guest editor, Shih-Chen Shi (National Cheng Kung University) and Tao-Hsing Chen (National Kaohsiung University of Science and Technology)
Call for paper


Special Issue on Sensing Beyond Transduction: Materials, Devices, and Signal Processing for Intelligent Sensory Systems
Guest editor, Masayuki Sohgawa (Niigata University)
Call for paper


Special Issue on Advanced Materials and Technologies for Sensor and Artificial- Intelligence-of-Things Applications (Selected Papers from ICASI 2026)
Guest editor, Sheng-Joue Young (National Yunlin University of Science and Technology)
Conference website
Call for paper


Special Issue on Biosensing Devices
Guest editor, Kiyotaka Sasagawa (Nara Institute of Science and Technology)
Call for paper


Copyright(C) MYU K.K. All Rights Reserved.