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Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
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Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.
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English 日本語
Instructions for manuscript preparation
English 日本語
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MYU K.K.
Sensors and Materials
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The Art of Writing Scientific Papers
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is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.
Instructions to authors
English 日本語
Instructions for manuscript preparation
English 日本語
Template
English
Publisher
MYU K.K.
Sensors and Materials
1-23-3-303 Sendagi,
Bunkyo-ku, Tokyo 113-0022, Japan
Tel: 81-3-3827-8549
Fax: 81-3-3827-8547
MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.
MYU Research
(proofreading and recording)
MYU K.K.
(translation service)
The Art of Writing Scientific Papers
(How to write scientific papers)
(Japanese Only)
Sensors and Materials, Volume 26, Number 6 (2014)
Copyright(C) MYU K.K.
Copyright(C) MYU K.K.
|
pp. 429-434
S&M1010 Research Paper of Special Issue https://doi.org/10.18494/SAM.2014.979 Published: July 29, 2014 Dependence of GaN Removal Rate of Plasma Chemical Vaporization Machining on Mechanically Introduced Damage [PDF] Yasuhisa Sano, Toshiro K. Doi, Syuhei Kurokawa, Hideo Aida, Osamu Ohnishi, Michio Uneda, Kousuke Shiozawa, Yu Okada and Kazuto Yamauchi (Received April 15, 2014; Accepted June 10, 2014) Keywords: hard-to-machine material, atmospheric-pressure plasma, PCVM, damaged layer, GaN
A high-efficiency planarization method combining atmospheric-pressure plasma etching [plasma chemical vaporization machining (PCVM)] and mechanical polishing is proposed. The convex part of a substrate surface, considered to be affected by mechanical action, is removed preferentially by PCVM. However, it is not evident whether the PCVM removal rate of the damaged layer of a gallium nitride (GaN) substrate increases. In this study, the dependence of removal rate on removal depth is investigated using a GaN substrate with a damaged layer. As a result, the removal rate of the damaged layer is observed to be three or four times greater than that of deep undamaged layers.
Corresponding author: Yasuhisa Sano Cite this article Yasuhisa Sano, Toshiro K. Doi, Syuhei Kurokawa, Hideo Aida, Osamu Ohnishi, Michio Uneda, Kousuke Shiozawa, Yu Okada and Kazuto Yamauchi, Dependence of GaN Removal Rate of Plasma Chemical Vaporization Machining on Mechanically Introduced Damage, Sens. Mater., Vol. 26, No. 6, 2014, p. 429-434. |
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