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Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
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Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.
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Sensors and Materials
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is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.
Instructions to authors
English 日本語
Instructions for manuscript preparation
English 日本語
Template
English
Publisher
MYU K.K.
Sensors and Materials
1-23-3-303 Sendagi,
Bunkyo-ku, Tokyo 113-0022, Japan
Tel: 81-3-3827-8549
Fax: 81-3-3827-8547
MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.
MYU Research
(proofreading and recording)
MYU K.K.
(translation service)
The Art of Writing Scientific Papers
(How to write scientific papers)
(Japanese Only)
Sensors and Materials, Volume 30, Number 12(2) (2018)
Copyright(C) MYU K.K.
Copyright(C) MYU K.K.
|
pp. 2905-2917
S&M1728 Research Paper of Special Issue https://doi.org/10.18494/SAM.2018.2009 Published: December 18, 2018 Fine Cone-shaped Bumps for Three-dimensional LSI Package—An Optimization of Thermocompression Bonding Process [PDF] Shunsuke Nemoto, Ying Ying Lim, Hiroshi Nakagawa, Katsuya Kikuchi, and Masahiro Aoyagi (Received May 26, 2018; Accepted August 8, 2018) Keywords: flip-chip bonding, 3D LSI, nanoparticle deposition, cone-shaped bump
Fine cone-shaped bumps (6 µm) were fabricated by a nanoparticle deposition method, where the nanoparticles were deposited onto hole patterns defined in a photoresist. In this work, the goal is to minimize the flip-chip bonding force of LSI chips targeted for three-dimensional (3D) packages while optimizing the bonding strength. In particular, the effects of temperature on the bump compressive stress and shear strength were investigated in detail. From the results, it was found that the crystal grain size of cone-shaped gold bumps increases significantly at ≥150 ℃, which in turn affects the mechanical properties of the bump. We also clarified the optimum connection conditions to simultaneously realize a low bonding force and an improved bonding strength by bonding at ≥200 °C.
Corresponding author: Shunsuke Nemoto Cite this article Shunsuke Nemoto, Ying Ying Lim, Hiroshi Nakagawa, Katsuya Kikuchi, and Masahiro Aoyagi, Fine Cone-shaped Bumps for Three-dimensional LSI Package—An Optimization of Thermocompression Bonding Process, Sens. Mater., Vol. 30, No. 12, 2018, p. 2905-2917. |
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