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Notice of retraction
Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
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Sensors and Materials, Volume 35, Number 11(3) (2023)
Copyright(C) MYU K.K.
pp. 3829-3849
S&M3453 Research Paper of Special Issue
https://doi.org/10.18494/SAM4627
Published: November 29, 2023

Land Cover Mapping of Bengaluru's Urban and Surrounding Area with Spatiotemporal Open-source Remote Sensing Data [PDF]

Sylvain Grison, Rajath Siddaganga, Renu Singh, Shrihari Hegde, Axel Brockmann, Smitha Krishnan, and Wei Guo

(Received August 28, 2023; Accepted November 20, 2023)

Keywords: land cover, Bengaluru, open data, remote sensing, urban area

The rapid urbanization observed in Asian tropics has resulted in extensive landscape transformations, giving rise to novel challenges such as conflicts of interest among citizens and threats to biodiversity. To facilitate informed urban management policies, there is a pressing need for contemporary land use and cover maps that provide precise insights into the evolving landscape. In this paper, we present the city of Bengaluru, India (covering an area of 365,879 ha) as a case study. We introduce an open-source-driven pipeline method capable of generating an updated 11-class land cover map at a high resolution of 10 m, achieving a global F1 score of 0.82. Notably, our proposed pipeline represents a pioneering solution that effectively addresses the persistent issue of cloud cover caused by monsoons, enhancing the utility of such maps for urban management, and planning in rapidly evolving regions.

Corresponding author: Wei Guo


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Cite this article
Sylvain Grison, Rajath Siddaganga, Renu Singh, Shrihari Hegde, Axel Brockmann, Smitha Krishnan, and Wei Guo, Land Cover Mapping of Bengaluru's Urban and Surrounding Area with Spatiotemporal Open-source Remote Sensing Data, Sens. Mater., Vol. 35, No. 11, 2023, p. 3829-3849.



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