pp. 197-208
S&M365 Research Paper Published: 1999 Chip-Scale Packaging of a Gyroscope Using Wafer Bonding [PDF] Douglas Sparks, Deron Slaughter, Ruth Beni, Larry Jordan, Michael Chia, David Rich, Jack Johnson and Timothy Vas Cite this article Douglas Sparks, Deron Slaughter, Ruth Beni, Larry Jordan, Michael Chia, David Rich, Jack Johnson and Timothy Vas, Chip-Scale Packaging of a Gyroscope Using Wafer Bonding, Sens. Mater., Vol. 11, No. 4, 1999, p. 197-208. |