pp. 197-208
S&M365 Research Paper Published: 1999 Chip-Scale Packaging of a Gyroscope Using Wafer Bonding [PDF] Douglas Sparks, Deron Slaughter, Ruth Beni, Larry Jordan, Michael Chia, David Rich, Jack Johnson and Timothy Vas ![]() Cite this article Douglas Sparks, Deron Slaughter, Ruth Beni, Larry Jordan, Michael Chia, David Rich, Jack Johnson and Timothy Vas, Chip-Scale Packaging of a Gyroscope Using Wafer Bonding, Sens. Mater., Vol. 11, No. 4, 1999, p. 197-208. |