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Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
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Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.
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English 日本語
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Sensors and Materials
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is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.
Instructions to authors
English 日本語
Instructions for manuscript preparation
English 日本語
Template
English
Publisher
MYU K.K.
Sensors and Materials
1-23-3-303 Sendagi,
Bunkyo-ku, Tokyo 113-0022, Japan
Tel: 81-3-3827-8549
Fax: 81-3-3827-8547
MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.
MYU Research
(proofreading and recording)
MYU K.K.
(translation service)
The Art of Writing Scientific Papers
(How to write scientific papers)
(Japanese Only)
Sensors and Materials, Volume 31, Number 3(1) (2019)
Copyright(C) MYU K.K.
Copyright(C) MYU K.K.
|
pp. 729-741
S&M1809 Research Paper of Special Issue https://doi.org/10.18494/SAM.2019.2076 Published: March 8, 2019 Effect of Free-standing Al/Ni Exothermic Film on Thermal Resistance of Reactively Bonded Solder Joint [PDF] Shunsuke Kanetsuki, Shugo Miyake, and Takahiro Namazu (Received August 6, 2018; Accepted November 14, 2018) Keywords: Al/Ni multilayer, self-propagating exothermic reaction, solder bonding, free-standing film, thermal resistance, void, crack
In this study, a free-standing Al/Ni exothermic multilayer is fabricated and used as a heat source for reactive soldering, instead of an Al/Ni film directly deposited on the solder layer. The free-standing film enables us to reduce not only cracking in the reacted NiAl layer but also voiding at the NiAl-solder interface. These positive effects have successfully resulted in the reduction in the thermal resistance of the joint. Electron probe microanalysis (EPMA) and electron backscattering diffraction (EBSD) analyses suggest that reducing the thermal resistance has been caused by mechanical strain originating from volume shrinkage induced by the Al/Ni exothermic reaction as well as heat conduction from the reactive film to the solder layer. The mechanism of reducing the number of voids is discussed in light of stress distribution during reactive bonding.
Corresponding author: Shunsuke Kanetsuki  This work is licensed under a Creative Commons Attribution 4.0 International License. Cite this article Shunsuke Kanetsuki, Shugo Miyake, and Takahiro Namazu, Effect of Free-standing Al/Ni Exothermic Film on Thermal Resistance of Reactively Bonded Solder Joint, Sens. Mater., Vol. 31, No. 3, 2019, p. 729-741. |
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