pp. 2511-2525
S&M1952 Research Paper of Special Issue https://doi.org/10.18494/SAM.2019.2443 Published: August 19, 2019 Experimental Comparison of Rapid Large-area Direct Electron Beam Exposure Methods with Plasmonic Devices [PDF] Akio Higo, Tomoki Sawamura, Makoto Fujiwara, Eric Lebrasseur, Ayako Mizushima, Etsuko Ota, and Yoshio Mita (Received May 23, 2019; Accepted July 25, 2019) Keywords: electron beam lithography, character projection, variable-shaped beam, nanopatterns, color filter
We have quantitatively investigated a periodic nanostructure exposure process by electron beam lithography (EBL). The targeted applications are nano- to micro-electromechanical systems (NEMS/MEMS), nanophotonics, surface plasmonic structures, and metamaterials. It is confirmed that the character projection (CP) method can obtain both high throughput and high resolution simultaneously as compared with the variable-shaped beam (VSB) method. We used square, triangular, and octagonal CP stencil masks to realize a nanohole array (NHA) of 10.4 mm2 area. The holes were placed in both square and hexagonal grid configurations. We measured the hole patterns by scanning electron microscopy (SEM) and scanning probe microscopy (SPM). Also, the effect of NHA size variation was measured on the basis of optical absorption spectra obtained using a system consisting of an optical microscope and a spectrum analyzer. The spectrum variation was confirmed to be in good agreement with the local size variation; identically fabricated NHAs showed identical spectra. It is therefore possible to control the nanometric critical dimensions by using NHAs as process indicators.
Corresponding author: Akio Higo and Yoshio MitaThis work is licensed under a Creative Commons Attribution 4.0 International License. Cite this article Akio Higo, Tomoki Sawamura, Makoto Fujiwara, Eric Lebrasseur, Ayako Mizushima, Etsuko Ota, and Yoshio Mita, Experimental Comparison of Rapid Large-area Direct Electron Beam Exposure Methods with Plasmonic Devices, Sens. Mater., Vol. 31, No. 8, 2019, p. 2511-2525. |