pp. 2077-2087
S&M2241 Research Paper of Special Issue https://doi.org/10.18494/SAM.2020.2802 Published: June 10, 2020 Fabrication of Integrated Device Comprising Flexible Dye-sensitized Solar Cell and Graphene-doped Supercapacitor [PDF] Wei-Ching Chuang, Chun-Ying Lee, Tung-Lung Wu, Chi-Ting Ho, Yu-Yao Kang, Chun-Hsien Lee, and Teen-Hang Meen (Received January 16, 2020; Accepted May 1, 2020) Keywords: supercapacitor, activated carbon, dye-sensitized solar cell
Currently, flexible surfaces are becoming increasingly common in electronic devices. Electronic devices fabricated on flexible substrates are considered to have potential. Flexible supercapacitors have a long cycle life, high power density, stability, and flexibility. In this study, a flexible supercapacitor was prepared using activated carbon doped with graphene and was integrated with a flexible dye-sensitized solar cell (DSSC) to fabricate an energy conversion/storage device. A baking method was used to make the activated carbon doped with graphene powder, and a paste of this powder was deposited for use as an electrode of the supercapacitor by spin coating. A press machine was used to transfer a sintered TiO2 film from a quartz substrate to an indium tin oxide/polyethylene naphthalate (ITO/PEN) plastic substrate to fabricate a flexible DSSC. The supercapacitor doped with 0.05 wt% graphene had the highest capacitance, which was 218 F/g with a charge–discharge efficiency of 85.29%. The flexible supercapacitor maintained its capacitance well even when it was bent. A flexible DSCC integrated with a supercapacitor was fabricated to successfully power an LED.
Corresponding author: Tung-Lung Wu, Teen-Hang MeenThis work is licensed under a Creative Commons Attribution 4.0 International License. Cite this article Wei-Ching Chuang, Chun-Ying Lee, Tung-Lung Wu, Chi-Ting Ho, Yu-Yao Kang, Chun-Hsien Lee, and Teen-Hang Meen, Fabrication of Integrated Device Comprising Flexible Dye-sensitized Solar Cell and Graphene-doped Supercapacitor , Sens. Mater., Vol. 32, No. 6, 2020, p. 2077-2087. |