S&M2915 Research Paper of Special Issue
Published: May 10, 2022
Analysis of Adhesion Strength between Silver Film and Substrate in Plain Silver Surface Plasmon Resonance Imaging Sensor [PDF]
Zhiyou Wang, Ye Wang, Maojin Wang, and Qinfang Zheng
(Received December 6, 2021; Accepted March 9, 2022)
Keywords: plain silver SPRi sensor, gold adhesion-enhancing layer, indentation-induced film breaking
Recently, a plain silver surface plasmon resonance imaging (SPRi) sensor with a gold adhesion-enhancing layer has been studied extensively because of its desirable sensitivity and durability. To study the effect of the gold adhesion-enhancing layer on the durability of the sensor, we studied the adhesion strength between the silver film and the substrate. In a cross-sectional analysis, we observed the spatial elemental distribution of the sensor and found clear chromium–gold and gold–silver interfaces under transmission electron microscopy (TEM). By the indentation-inducing film method, we measured the critical load and depth of the silver film breaking. We also tested the working and shelf lives of the sensor with different thicknesses of the adhesion-enhancing layer. Testing results showed that the adhesion-enhancing layer thickness was related to the shelf life of the sensor. Results of the above studies showed that the gold adhesion-enhancing layer improved the adhesion strength of the silver film and the durability of the plain silver SPRi sensor.Corresponding author: Zhiyou Wang, Qinfang Zheng
This work is licensed under a Creative Commons Attribution 4.0 International License.
Cite this article
Zhiyou Wang, Ye Wang, Maojin Wang, and Qinfang Zheng, Analysis of Adhesion Strength between Silver Film and Substrate in Plain Silver Surface Plasmon Resonance Imaging Sensor, Sens. Mater., Vol. 34, No. 5, 2022, p. 1629-1638.