pp. 2741-2753
S&M3351 Research Paper of Special Issue https://doi.org/10.18494/SAM4450 Published: August 15, 2023 Design of Light-emitting Diode Device Considering Sensor Technology Using Analytical Hierarchical Procedure [PDF] Hsin-Hung Lin, Ching-Hui Chen, and Cheng-Chung Kuo (Received April 7, 2023; Accepted July 14, 2023) Keywords: fuzzy decision method, fan, numerical simulation, AHP, fan experiment
Rapid technological and economic development has created intense competition in today’s consumer market. Thus, design is playing a more important role in product development than before, especially in the development of electronic devices. In the design of a new electronic device, the use of light-emitting diode (LED) and sensors has become increasingly inevitable. However, it is not easy to evaluate the design of a product from the viewpoints of both consumers and developers or manufacturers. Therefore, using the analytical hierarchical process (AHP) and fuzzy evaluation method and taking an LED device with a fan as an example, we determined the important criteria and factors in designing a new product. The criteria and factors were defined through interviews and a questionnaire survey with 14 experts. As a result, 24 factors were found to affect the five criteria of function, efficiency, aesthetics, creativity, and economy. The AHP and fuzzy evaluation results indicated efficiency to be the most important criterion and the fan air volume of the LED device the most critical factor in the design. Convenience, product texture, innovation, and product packaging were also found to be important in designing the LED device. The results of this study may be a reference for developing new products with sensors and LEDs.
Corresponding author: Cheng-Chung KuoThis work is licensed under a Creative Commons Attribution 4.0 International License. Cite this article Hsin-Hung Lin, Ching-Hui Chen, and Cheng-Chung Kuo, Design of Light-emitting Diode Device Considering Sensor Technology Using Analytical Hierarchical Procedure, Sens. Mater., Vol. 35, No. 8, 2023, p. 2741-2753. |