Wire bonding is one of the important assembling processes in the semiconductor manufacturing industry. It is responsible for connecting a good die to a lead frame using automatic equipment called wire bonders. Among all the assembling processes, wire bonding is one of the most time-consuming processes. Therefore, it is crucial to monitor the states of wire bonders in order to efficiently repair and maintain them. This becomes especially important when there are numerous wire bonders in the production line, as it helps improve productivity. In this study, we developed an information system that communicates with wire bonders using Semiconductor Equipment and Materials International (SEMI) Equipment Communications Standard (SECS) sensors. The SECS sensors, which combine the SECS protocol and the functions of the equipment automation program (EAP), take charge of receiving and responding messages from wire bonders and hosts, and acts as a bridge to help collect information on wire bonders and transmit it to our system. The developed system can show the states and error messages of wire bonders, wires, and bond heads. It also provides historical records and availability information of wire bonders. This assists managers in making informed decisions to reduce the time and effort required for maintaining wire bonders. Overall, our system effectively enhances the monitoring and maintenance processes of wire bonders, leading to improved productivity in assembling production.