Young Researcher Paper Award 2022
🥇Winners

Notice of retraction
Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

Instructions to authors
English    日本語

Instructions for manuscript preparation
English    日本語

Template
English

Publisher
 MYU K.K.
 Sensors and Materials
 1-23-3-303 Sendagi,
 Bunkyo-ku, Tokyo 113-0022, Japan
 Tel: 81-3-3827-8549
 Fax: 81-3-3827-8547

MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.


MYU Research

(proofreading and recording)


MYU K.K.
(translation service)


The Art of Writing Scientific Papers

(How to write scientific papers)
(Japanese Only)

Sensors and Materials, Volume 36, Number 2(1) (2024)
Copyright(C) MYU K.K.
pp. 415-425
S&M3528 Research Paper
https://doi.org/10.18494/SAM4707
Published: February 6, 2024

Cavity-Depth Effect on 3D Wafer-Level-Packaged MEMS Resonators by Slide-Film Damping [PDF]

Hengmao Liang, Shilei Lv, Songjia Han, Hongshan Liu, and Yongbing Long

(Received October 23, 2023; Accepted November 13, 2023)

Keywords: slide-film damping, cavity depth, MEMS resonator, wafer-level packaging, damping coefficient, quality factor

The slide-film damping effect caused by cavity structures is easily neglected in the design of bulk-micro-machined resonant MEMS device fabrication and packaging processes. On the basis of theory calculations, simulations, and actual tests, in this study, we investigate the cavity-depth effect on 3D wafer-level packaged MEMS resonators with the in-plane-motion mode, in which slide-film damping is dominant. On the one hand, it is found that the slide-film damping coefficient is inversely proportional to the cavity depth and remains stable for the cavity depth above a specific value. The critical cavity depth acquired from theoretical results is ~10 μm, which is distinct from that of ~30 μm from simulation results. On the other hand, the variation tendency of simulation results is more in agreement with those of test results for fabricated devices than the theoretical prediction. Hence, before the structure fabrication for a resonator dominated by slide-film damping, it is imperative to choose a conservative cavity depth with a relatively high value from the combination of theory and simulation analyses, so as to ensure the high or desired Q-factors of fabricated resonators, particularly in wafer-level packaging with the low-vacuum or atmospheric pressure. Overall, this work provides not only an analysis strategy on device cavities’ slide-film damping but also the optimization design of wafer-level packaging structures and processes.

Corresponding author: Hengmao Liang


Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 International License.

Cite this article
Hengmao Liang, Shilei Lv, Songjia Han, Hongshan Liu, and Yongbing Long , Cavity-Depth Effect on 3D Wafer-Level-Packaged MEMS Resonators by Slide-Film Damping, Sens. Mater., Vol. 36, No. 2, 2024, p. 415-425.



Forthcoming Regular Issues


Forthcoming Special Issues

Special Issue on Innovations of Sensor Applications and Related Technologies in IoT
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Cheng-Fu Yang (National University of Kaohsiung)
Call for paper


Special Issue on Advanced Data Sensing and Processing Technologies for Smart Community and Smart Life
Guest editor, Tatsuya Yamazaki (Niigata University)
Call for paper


Special Issue on Advanced Sensing Technologies and Their Applications in Human/Animal Activity Recognition and Behavior Understanding
Guest editor, Kaori Fujinami (Tokyo University of Agriculture and Technology)
Call for paper


Special Issue on Sensors and Artificial Intelligence for Smart Education Environments : Part 2
Guest editor, Chih Hsien Hsia (National Ilan University)
Call for paper


Special Issue on Advanced Micro/Nanomaterials for Various Sensor Applications (Selected Papers from ICASI 2022/2023)
Guest editor, Sheng-Joue Young (National United University)
Conference website
Call for paper


Special Issue on Advanced Micro/Nanomaterials for Various Sensor Applications (Selected Papers from ICASI 2024)
Guest editor, Sheng-Joue Young (National United University)
Conference website
Call for paper


Copyright(C) MYU K.K. All Rights Reserved.