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S&M4284 Research paper https://doi.org/10.18494/SAM6028 Published: January 8, 2026 Traction Microsystem with Force Sensing for Colon Endoscopic Submucosal Dissection [PDF] Xinchi Gao, Noriko Tsuruoka, Wenrui Liu, Yuto Sakaguchi, Yosuke Tsuji, Mitsuhiro Fujishiro, Fumihito Arai, and Yoichi Haga (Received November 14, 2025; Accepted December 23, 2025) Keywords: ESD, traction, force sensor, slip ring, strain gauge, flexible endoscope
Endoscopic submucosal dissection enables the en bloc resection of colorectal lesions with curative intent for early cancers, but it is technically demanding and carries risks such as bleeding and perforation, partly due to limited visualization within the submucosal layer. A narrow field of view, curled incision edges, and insufficient traction can obscure the cutting plane and increase procedural difficulty. Effective traction is critical for improving visibility and facilitating safer resections, yet common methods such as clip-with-line often add procedural complexity and lack real-time force monitoring. We present a traction microsystem that integrates a micromotor, a slip ring, and a miniaturized force-sensing unit into an endoscope-deliverable module. The slip ring allows continuous rotation without torsional buildup, maintaining stable tension during operation. The force sensor utilizes a 3D-printed flexure with a strain gauge to amplify deformation, achieving high sensitivity in a compact form that enables real-time force readouts. This architecture supports controlled mucosal lifting with feedback-guided traction, enhancing submucosal exposure and potentially improving resection accuracy and safety.
Corresponding author: Noriko Tsuruoka![]() ![]() This work is licensed under a Creative Commons Attribution 4.0 International License. Cite this article Xinchi Gao, Noriko Tsuruoka, Wenrui Liu, Yuto Sakaguchi, Yosuke Tsuji, Mitsuhiro Fujishiro, Fumihito Arai, and Yoichi Haga, Traction Microsystem with Force Sensing for Colon Endoscopic Submucosal Dissection, Sens. Mater., Vol. 38, No. 1, 2026, p. 71-88. |