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S&M4470 Report https://doi.org/10.18494/SAM6050 Published: May 29, 2026 Design of a Planar Metamaterial Absorber Capable of Optical Sensing from 500 to 3160 nm [PDF] Kao-Peng Min, Yu-Ting Gao, Cheng-Fu Yang, Chi-Ting Ho, Walter Water, and Kao-Wei Min (Received November 18, 2025; Accepted May 19, 2026) Keywords: ultra-broadband absorber, optical absorber, numerical simulation, finite element method, COMSOL Multiphysics, multilayer thin-film scattering medium, electromagnetic field distribution
In this study, a planar multilayer metamaterial absorber capable of optical sensing across an ultra-broadband spectrum was designed and numerically analyzed using the finite element method implemented in the simulation software COMSOL Multiphysics (V6.0). The absorber consists of alternating metal–dielectric layers, with SiO2 serving as the scattering medium to enhance electromagnetic coupling and impedance matching. A six-layer planar structure composed of V, Ge, Bi, and Co was first developed, achieving an average absorptivity of 94.56% within the 500–3160 nm wavelength range, though a slight absorption dip was observed between 400–500 nm. By introducing additional SiO2 and Co layers to form an eight-layer configuration, the absorption bandwidth was broadened to 400–3700 nm with an average absorptivity of 93.69%. Furthermore, replacing Co with Ti extended the spectral response to 400–4000 nm, demonstrating enhanced optical adaptability. These findings indicate a design trade-off between absorption efficiency and bandwidth coverage, offering valuable insights for the development of high-performance optoelectronic and sensing devices based on planar metamaterial architectures.
Corresponding author: Cheng-Fu Yang![]() ![]() This work is licensed under a Creative Commons Attribution 4.0 International License. Cite this article Kao-Peng Min, Yu-Ting Gao, Cheng-Fu Yang, Chi-Ting Ho, Walter Water, and Kao-Wei Min, Design of a Planar Metamaterial Absorber Capable of Optical Sensing from 500 to 3160 nm, Sens. Mater., Vol. 38, No. 5, 2026, p. 2799-2812. |