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Sensors and Materials, Volume 38, Number 5(2) (2026)
Copyright(C) MYU K.K.
pp. 2597-2612
S&M4456 Research paper
https://doi.org/10.18494/SAM6088
Published: May 22, 2026

Universal High-potential Testing System for AC/DC Power Supplies in Automated Manufacturing Environments [PDF]

Cheng-Yi Chen, Yao-Hung Tsai, Pei-Jun Ma, and Bo-Wun Huang

(Received November 28, 2025; Accepted January 15, 2026)

Keywords: power supply, high-potential test, manufacturing execution system, universal testing system

Amid declining birth rates and a global labor shortage, automated electrical testing has become essential for industrial development. However, many factories face technological lock-in due to long-term reliance on a single vendor’s automation systems, resulting in high sunk costs and significant challenges when upgrading or switching platforms. In this paper, we propose a universal automated high-potential test system (UHPTS) designed to operate seamlessly across multiple instrument brands. The system unifies communication protocols by mapping instrument commands to standardized labels and retrieving the required instructions from a centralized database, in accordance with the selected test environment. This architecture enables cross-platform interoperability within a single testing framework. The UHPTS can also be integrated with the manufacturing execution system (MES), allowing automatic parameter loading via product barcodes and supporting fully automated, operator-independent testing. Experimental results verify that the proposed system reduces operational complexity, eliminates vendor lock-in, minimizes human error, and enhances testing efficiency and reliability. Overall, the UHPTS offers a scalable and practical solution for modernizing withstand-voltage testing in power supply manufacturing.

Corresponding author: Cheng-Yi Chen and Bo-Wun Huang


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Cite this article
Cheng-Yi Chen, Yao-Hung Tsai, Pei-Jun Ma, and Bo-Wun Huang, Universal High-potential Testing System for AC/DC Power Supplies in Automated Manufacturing Environments, Sens. Mater., Vol. 38, No. 5, 2026, p. 2597-2612.



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