pp. 177-187
S&M912 Research Paper of Special Issue https://doi.org/10.18494/SAM.2013.852 Published: March 28, 2013 Assessment of Stacking Faults in Silicon Carbide Crystals [PDF] Hidekazu Yamamoto (Received September 24, 2012; Accepted November 5, 2012) Keywords: silicon carbide (SiC), staking fault, X-ray topography, photoluminescence (PL), mirror electron microscopy (MEM), atomic force microscopy (AFM)
X-ray topography, photoluminescence (PL) spectroscopy, mirror electron microscopy (MEM), and atomic force microscopy (AFM) were employed to evaluate stacking faults in silicon carbide (SiC) crystals. The results reveal that transmission X-ray topography can be used to assess internal stacking faults in crystals, while PL spectroscopy and MEM can be used to assess stacking faults near the surface. The stacking faults assessed by these different methods were found to be the same. AFM revealed that sites where stacking faults were exposed on the surface had microscopic level differences of about 0.1 nm, which are thought to be generated by different etch rates during mirror polishing.
Corresponding author: Hidekazu YamamotoCite this article Hidekazu Yamamoto, Assessment of Stacking Faults in Silicon Carbide Crystals, Sens. Mater., Vol. 25, No. 3, 2013, p. 177-187. |