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Vol. 34, No. 8(3), S&M3042

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Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
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Sensors and Materials, Volume 25, Number 3 (2013)
Copyright(C) MYU K.K.
pp. 177-187
S&M912 Research Paper of Special Issue
https://doi.org/10.18494/SAM.2013.852
Published: March 28, 2013

Assessment of Stacking Faults in Silicon Carbide Crystals [PDF]

Hidekazu Yamamoto

(Received September 24, 2012; Accepted November 5, 2012)

Keywords: silicon carbide (SiC), staking fault, X-ray topography, photoluminescence (PL), mirror electron microscopy (MEM), atomic force microscopy (AFM)

X-ray topography, photoluminescence (PL) spectroscopy, mirror electron microscopy (MEM), and atomic force microscopy (AFM) were employed to evaluate stacking faults in silicon carbide (SiC) crystals. The results reveal that transmission X-ray topography can be used to assess internal stacking faults in crystals, while PL spectroscopy and MEM can be used to assess stacking faults near the surface. The stacking faults assessed by these different methods were found to be the same. AFM revealed that sites where stacking faults were exposed on the surface had microscopic level differences of about 0.1 nm, which are thought to be generated by different etch rates during mirror polishing.

Corresponding author: Hidekazu Yamamoto


Cite this article
Hidekazu Yamamoto, Assessment of Stacking Faults in Silicon Carbide Crystals, Sens. Mater., Vol. 25, No. 3, 2013, p. 177-187.



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