This paper describes the characteristics of anodic-bonded multilayer ceramic actuators (MCA) on Si wafers using sputtered Pyrex #7740 glass thin films for micro-electromechanical system (MEMS) applications. The Pyrex #7740 glass thin films were deposited on MCA under optimum RF magnetron conditions (Ar:O2 gas ratio of 100%, input power of 1 W/cm2). After annealing at 450℃ for 1 h, the anodic bonding of MCA to a Si wafer was successfully performed at 600 V, at 400℃ and –760 mmHg. The properties of the MCA/Si bonded interface and fabricated Si diaphragm deflection were analyzed through the actuation test. It is possible to control with accuracy the deflection of a Si diaphragm according to its geometry; here, a maximum nonlinearity of 0.05–0.08% FS was observed. Moreover, no damage or separation of MCA/Si bonded interfaces occurred during the actuation test. Therefore, it is expected that anodic bonding technology of MCA/Si wafers could be usefully applied to the fabrication process of high-performance piezoelectric MEMS devices.