pp. 69-76
S&M1047 Research Paper of Special Issue https://doi.org/10.18494/SAM.2015.1070 Published: January 29, 2015 Online Test Structure for Measuring Young's Modulus and Residual Stress of the Top Silicon Layer of Silicon-On-Insulator by a Pull-in Approach [PDF] Shixuan Gao, Zaifa Zhou, Weihua Li and Qing-an Huang (Received July 14, 2014; Accepted December 8, 2014) Keywords: SOI, measurement, pull-in, mechanical properties, in situ
In this study, we proposed a novel test structure that can eliminate the effects of gravity and the release process and compared it with the traditional pull-in structure where the beam can vibrate laterally. This novel structure, which simply uses the top silicon layer to form a complete pull-in test structure, processes both a fixed-fixed beam and a fixed electrode on the top silicon layer of silicon-on-insulator (SOI). In addition, the equation concerning the applied voltage, Young's modulus, and residual stress was developed by the energy method. A parametric simulation was performed to obtain a structure with optimized dimensions and satisfy the equation concerning the applied voltage, Young's modulus, and residual stress. Experimental results show that the measurement system used has the advantages of high precision and rapid testing. The measured average Young's modulus is 110.9 GPa and the residual stress is 4.4914 MPa.
Corresponding author: Zaifa ZhouCite this article Shixuan Gao, Zaifa Zhou, Weihua Li and Qing-an Huang, Online Test Structure for Measuring Young's Modulus and Residual Stress of the Top Silicon Layer of Silicon-On-Insulator by a Pull-in Approach, Sens. Mater., Vol. 27, No. 1, 2015, p. 69-76. |