Young Researcher Paper Award 2023
🥇Winners

Notice of retraction
Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

Instructions to authors
English    日本語

Instructions for manuscript preparation
English    日本語

Template
English

Publisher
 MYU K.K.
 Sensors and Materials
 1-23-3-303 Sendagi,
 Bunkyo-ku, Tokyo 113-0022, Japan
 Tel: 81-3-3827-8549
 Fax: 81-3-3827-8547

MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.


MYU Research

(proofreading and recording)


MYU K.K.
(translation service)


The Art of Writing Scientific Papers

(How to write scientific papers)
(Japanese Only)

Sensors and Materials, Volume 32, Number 10(2) (2020)
Copyright(C) MYU K.K.
pp. 3283-3295
S&M2339 Research Paper
https://doi.org/10.18494/SAM.2020.2943
Published: October 20, 2020

Prediction of Tool Fracture in Punching of Thick Steel Plate [PDF]

Minoru Yamashita, Taiki Murase, and Makoto Nikawa

(Received May 14, 2020; Accepted August 28, 2020)

Keywords: acoustic emission, punching, tool fracture, prediction

The sensing of acoustic emission (AE) is efficiently used for the detection of the crack initiation of brittle materials and defects in plastic forming and other manufacturing processes. We carried out circular hole punching tests using carbon steel S45C plates of 5 or 6 mm thickness. The objective was to capture the occurrence of cracks as a predictive phenomenon of punch fracture and their propagation during punching by using an AE sensor. The impulsive stress acting on the punch due to the sudden drop in punch force at the fracture of the plate was also measured using strain gages. This stress induced fracture at the stepped portion of the punch. The maximum tensile stress of the punch depended on the fillet radius at the stepped portion. A reciprocal punching test using both plates alternately was performed to evaluate the detection of crack initiation using an AE waveform. Features in the AE waveform due to crack initiation and the frictional behavior of the crack were captured.

Corresponding author: Minoru Yamashita


Creative Commons License
This work is licensed under a Creative Commons Attribution 4.0 International License.

Cite this article
Minoru Yamashita, Taiki Murase, and Makoto Nikawa, Prediction of Tool Fracture in Punching of Thick Steel Plate, Sens. Mater., Vol. 32, No. 10, 2020, p. 3283-3295.



Forthcoming Regular Issues


Forthcoming Special Issues

Special Issue on Applications of Novel Sensors and Related Technologies for Internet of Things
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Cheng-Fu Yang (National University of Kaohsiung)
Call for paper


Special Issue on Advanced Sensing Technologies for Green Energy
Guest editor, Yong Zhu (Griffith University)
Call for paper


Special Issue on Room-temperature-operation Solid-state Radiation Detectors
Guest editor, Toru Aoki (Shizuoka University)
Call for paper


Special Issue on International Conference on Biosensors, Bioelectronics, Biomedical Devices, BioMEMS/NEMS and Applications 2023 (Bio4Apps 2023)
Guest editor, Dzung Viet Dao (Griffith University) and Cong Thanh Nguyen (Griffith University)
Conference website
Call for paper


Special Issue on Advanced Sensing Technologies and Their Applications in Human/Animal Activity Recognition and Behavior Understanding
Guest editor, Kaori Fujinami (Tokyo University of Agriculture and Technology)
Call for paper


Special Issue on Signal Collection, Processing, and System Integration in Automation Applications
Guest editor, Hsiung-Cheng Lin (National Chin-Yi University of Technology)
Call for paper


Copyright(C) MYU K.K. All Rights Reserved.