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Notice of retraction
Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

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Sensors and Materials, Volume 32, Number 10(2) (2020)
Copyright(C) MYU K.K.
pp. 3283-3295
S&M2339 Research Paper
https://doi.org/10.18494/SAM.2020.2943
Published: October 20, 2020

Prediction of Tool Fracture in Punching of Thick Steel Plate [PDF]

Minoru Yamashita, Taiki Murase, and Makoto Nikawa

(Received May 14, 2020; Accepted August 28, 2020)

Keywords: acoustic emission, punching, tool fracture, prediction

The sensing of acoustic emission (AE) is efficiently used for the detection of the crack initiation of brittle materials and defects in plastic forming and other manufacturing processes. We carried out circular hole punching tests using carbon steel S45C plates of 5 or 6 mm thickness. The objective was to capture the occurrence of cracks as a predictive phenomenon of punch fracture and their propagation during punching by using an AE sensor. The impulsive stress acting on the punch due to the sudden drop in punch force at the fracture of the plate was also measured using strain gages. This stress induced fracture at the stepped portion of the punch. The maximum tensile stress of the punch depended on the fillet radius at the stepped portion. A reciprocal punching test using both plates alternately was performed to evaluate the detection of crack initiation using an AE waveform. Features in the AE waveform due to crack initiation and the frictional behavior of the crack were captured.

Corresponding author: Minoru Yamashita


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Cite this article
Minoru Yamashita, Taiki Murase, and Makoto Nikawa, Prediction of Tool Fracture in Punching of Thick Steel Plate, Sens. Mater., Vol. 32, No. 10, 2020, p. 3283-3295.



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