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Notice of retraction
Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
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Sensors and Materials, Volume 35, Number 3(3) (2023)
Copyright(C) MYU K.K.
pp. 1023-1033
S&M3225 Research Paper
https://doi.org/10.18494/SAM4276
Published in advance: February 20, 2023
Published: March 23, 2023

Surface Treatment of Polyimide Using Solid-source H2O Plasma for Fabrication of Ge Electrode [PDF]

Mie Tohnishi, Mina Sato, Akihiro Matsutani, Takashi Ubukata, and Sachiko Matsushita

(Received December 5, 2022; Accepted February 13, 2023)

Keywords: flexible semiconductor electrode, Ge, polyimide, H2O plasma, heterogeneous material adhesion

We demonstrated the surface treatment of polyimide using solid-source H2O plasma for the fabrication of Ge thin films as an electrode of flexible devices. By using the solid-source H2O plasma, the internal stress of a polyimide sheet with deposited Ge was decreased, and the adhesion between the polyimide and Ge was also improved. In addition, the solid-source H2O plasma treatment was effective for increasing the bending durability and decreasing the resistance of the Ge electrode on a polyimide surface. Moreover, we analyzed a polyimide surface treated with solid-source H2O plasma, by Fourier transform IR spectroscopy and X-ray photoelectron spectroscopy. We believe that the proposed solid-source H2O plasma process is useful for bonding between polyimide and Ge in the fabrication of flexible semiconductor electrodes.

Corresponding author: Mie Tohnishi


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Cite this article
Mie Tohnishi, Mina Sato, Akihiro Matsutani, Takashi Ubukata, and Sachiko Matsushita, Surface Treatment of Polyimide Using Solid-source H2O Plasma for Fabrication of Ge Electrode, Sens. Mater., Vol. 35, No. 3, 2023, p. 1023-1033.



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