pp. 1023-1033
S&M3225 Research Paper https://doi.org/10.18494/SAM4276 Published in advance: February 20, 2023 Published: March 23, 2023 Surface Treatment of Polyimide Using Solid-source H2O Plasma for Fabrication of Ge Electrode [PDF] Mie Tohnishi, Mina Sato, Akihiro Matsutani, Takashi Ubukata, and Sachiko Matsushita (Received December 5, 2022; Accepted February 13, 2023) Keywords: flexible semiconductor electrode, Ge, polyimide, H2O plasma, heterogeneous material adhesion
We demonstrated the surface treatment of polyimide using solid-source H2O plasma for the fabrication of Ge thin films as an electrode of flexible devices. By using the solid-source H2O plasma, the internal stress of a polyimide sheet with deposited Ge was decreased, and the adhesion between the polyimide and Ge was also improved. In addition, the solid-source H2O plasma treatment was effective for increasing the bending durability and decreasing the resistance of the Ge electrode on a polyimide surface. Moreover, we analyzed a polyimide surface treated with solid-source H2O plasma, by Fourier transform IR spectroscopy and X-ray photoelectron spectroscopy. We believe that the proposed solid-source H2O plasma process is useful for bonding between polyimide and Ge in the fabrication of flexible semiconductor electrodes.
Corresponding author: Mie TohnishiThis work is licensed under a Creative Commons Attribution 4.0 International License. Cite this article Mie Tohnishi, Mina Sato, Akihiro Matsutani, Takashi Ubukata, and Sachiko Matsushita, Surface Treatment of Polyimide Using Solid-source H2O Plasma for Fabrication of Ge Electrode, Sens. Mater., Vol. 35, No. 3, 2023, p. 1023-1033. |