pp. 1693-1706
S&M3627 Research Paper of Special Issue https://doi.org/10.18494/SAM4892 Published: April 30, 2024 Employment of Finite Element Analysis Method to Analyze the Thermal Effects of Direct Energy Deposition on SUS316L [PDF] Wenjie Zheng, Hung-Yu Chang, Chao-Ming Hsu, and Cheng-Fu Yang (Received January 3, 2024; Accepted April 17, 2024) Keywords: direct energy deposition, finite element method, ANSYS, displacement, SUS316L
In this study, we investigated the displacement behavior of SUS316L stainless steel under five consecutive direct energy depositions through experiments and the use of the ANSYS commercial finite element method software. We explored the effects of displacement after cooling the five deposited layers and examined the relationship between different curvatures and laser parameters, including laser power and laser feed rate. In this research, a complete cross-sectional profile was obtained through experiments. Subsequently, simulations were conducted using laser powers of 300, 400, and 500 W, along with laser feed rates of 3, 5, and 7 mm/s, employing a thermal-solid coupling model. The results indicated that the optimal preheating temperature during the deposition process was around 150 °C, leading to a more stable displacement difference. The influence of curvature on displacement was relatively consistent along the neutral axis, allowing for the prediction of large displacement amounts along a straight-line path. Through simulation, it could be understood that when utilizing direct energy deposition to deposit SUS316L, considering the displacement conditions during the deposition process, it was preferable to use a low laser power and a high deposition rate.
Corresponding author: Chao-Ming Hsu and Cheng-Fu YangThis work is licensed under a Creative Commons Attribution 4.0 International License. Cite this article Wenjie Zheng, Hung-Yu Chang, Chao-Ming Hsu, and Cheng-Fu Yang, Employment of Finite Element Analysis Method to Analyze the Thermal Effects of Direct Energy Deposition on SUS316L, Sens. Mater., Vol. 36, No. 4, 2024, p. 1693-1706. |