Material strength measurements have been performed by combining mechanical material characterization and lattice diffraction experiments using hard X-rays. When X-ray diffraction experiments are performed simultaneously with tensile tests, plastic deformation due to stress can be analyzed at the lattice level. Although this evaluation procedure is suitable for materials such as metals, it does not provide information on molecular state changes and stress-induced electronic state transitions in polymer materials. Combined with an evaluation system in the electron energy band involved in chemical bonding during the tensile stress application, the systems would advance our understanding of adhesion states such as interfaces in polymer materials and composites. Here, we developed a MEMS-based system aimed at implementing a Raman spectroscopy imaging system and a stress control system on a soft X-ray absorption spectroscopy and photoelectron spectroscopy microscopy (PEEM) system. We prepared two types of MEMS device: a double-sided beam structure device and a three-point tensile testing device. A three-point tensile MEMS was integrated into a micro-Raman spectroscopy system to perform micro-Raman spectroscopy measurements during the tensile testing of a silicon beam. As for the double-sided beam structure MEMS, it was successfully introduced into the synchrotron radiation PEEM system and its operation was confirmed in vacuum.