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Sensors and Materials, Volume 37, Number 10(4) (2025)
Copyright(C) MYU K.K.
pp. 4795-4805
S&M4214 Research Paper
https://doi.org/10.18494/SAM5864
Published: October 31, 2025

Impact-based Nondestructive Sensing and Machine Learning for Eggshell Thickness Prediction in Food Processing [PDF]

Chia-Chun Lai, Ting-En Wu, Sih-Hao Huang, and Chia-Hung Lai

(Received July 28, 2025; Accepted October 14, 2025)

Keywords: machine learning, duck eggs, eggshell thickness

We present a nondestructive and data-driven method for predicting eggshell thickness using impact-based sensing and machine learning. A custom low-speed impact module was developed to simulate mechanical responses of duck eggshells, and the Hertzian contact theory was employed to interpret deformation behavior. Three machine learning models—random forest (RF), XGBoost, and K-nearest neighbors (KNN)—were implemented and optimized with metaheuristic algorithms, including particle swarm optimization (PSO). Among them, the RF model obtained by PSO demonstrated superior prediction accuracy with an R2 of 0.65155 and a mean squared error (MSE) of 0.00044. The proposed approach offers a scalable, cost-effective alternative to traditional eggshell assessment techniques and can be readily integrated into industrial egg grading systems to enhance food quality monitoring and reduce product waste.

Corresponding author: Chia-Hung Lai


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This work is licensed under a Creative Commons Attribution 4.0 International License.

Cite this article
Chia-Chun Lai, Ting-En Wu, Sih-Hao Huang, and Chia-Hung Lai, Impact-based Nondestructive Sensing and Machine Learning for Eggshell Thickness Prediction in Food Processing, Sens. Mater., Vol. 37, No. 10, 2025, p. 4795-4805.



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