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Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
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Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.
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Sensors and Materials
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is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.
Instructions to authors
English 日本語
Instructions for manuscript preparation
English 日本語
Template
English
Publisher
MYU K.K.
Sensors and Materials
1-23-3-303 Sendagi,
Bunkyo-ku, Tokyo 113-0022, Japan
Tel: 81-3-3827-8549
Fax: 81-3-3827-8547
MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.
MYU Research
(proofreading and recording)
MYU K.K.
(translation service)
The Art of Writing Scientific Papers
(How to write scientific papers)
(Japanese Only)
Sensors and Materials, Volume 23, Number 2 (2011)
Copyright(C) MYU K.K.
Copyright(C) MYU K.K.
|
pp. 101-110
S&M830 Research Paper https://doi.org/10.18494/SAM.2011.667 Published: March 1, 2011 Interconnection Characteristics of Rivet Packaging for Radio Frequency Microelectromechanical Systems Applications [PDF] Sungchan Kang, Eunsung Lee, Hyeon Cheol Kim, Byeungleul Lee and Kukjin Chun (Received December 15, 2009; Accepted April 21, 2010) Keywords: rivet packaging, wafer-level package, RF MEMS, through-via
In this paper, we present an alternative method of rivet packaging for radio frequency microelectromechanical system (RF MEMS) devices and evaluate its electrical characteristics. The rivet packaging enables not only encapsulation but also through-via interconnection at the same time. Moreover, it is possible to achieve a wafer-level process. The electrical performance was evaluated using Cu hollow-filled through-via interconnection. The overall insertion loss of the through-via interconnection from the bottom CPW to the top CPW decreased from 0.04 to 0.11 dB at 2 GHz and from 0.06 to 0.23 dB at 5 GHz.
Corresponding author: Kukjin Chun Cite this article Sungchan Kang, Eunsung Lee, Hyeon Cheol Kim, Byeungleul Lee and Kukjin Chun, Interconnection Characteristics of Rivet Packaging for Radio Frequency Microelectromechanical Systems Applications, Sens. Mater., Vol. 23, No. 2, 2011, p. 101-110. |
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