Vol. 22 No. 1
Special Issue on Evaluation Methods for Material Properties of MEMS/NEMS Devices
Guest Editor: Kuniki Ohwada (Teikyo University)
S&M784Research Paper of Special Issue |
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S&M784 Tensile Testing of Single-Crystal Silicon Thin Films at 600 oC Using Infrared Radiation Heating Toshiyuki Tsuchiya, Tetsuro Ikeda, Akifumi Tsunematsu, Koji Sugano and Osamu Tabata pp. 1-11 https://doi.org/10.18494/SAM.2010.619 Published on January 14, 2010 |
S&M785Research Paper of Special Issue |
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S&M785 Tensile and Creep Characteristics of Sputtered Gold-Tin Eutectic Solder Film Evaluated by XRD Tensile Testing Takahiro Namazu, Hideki Takemoto and Shozo Inoue pp. 13-24 https://doi.org/10.18494/SAM.2010.595 Published on January 14, 2010 |
S&M786Research Paper of Special Issue |
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S&M786 Effect of Specimen Shape on Test Results of Au Freestanding Film Measured by Strip Bending Method Jungmin Park, Jae-Hyun Kim, Sang-Joo Lee, Bongkyun Jang, Bung-Ik Choi and Hak-Joo Lee pp. 25-37 https://doi.org/10.18494/SAM.2010.626 Published on January 14, 2010 |
S&M787Research Paper of Special Issue |
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S&M787 Development of Amplitude-Controlled Parallel-Fatigue-Test System for Micro-Electromechanical Resonators Tsuyoshi Ikehara and Toshiyuki Tsuchiya pp. 39-50 https://doi.org/10.18494/SAM.2010.618 Published on January 14, 2010 |
S&M788Research Paper of Special Issue |
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S&M788 Resonant Bending Fatigue Tests on Thin Films Kwangsik Kwak, Masaaki Otsu and Kazuki Takashima pp. 51-59 https://doi.org/10.18494/SAM.2010.627 Published on January 14, 2010 |
Cover of this Issue |
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