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Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
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Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.
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English 日本語
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MYU K.K.
Sensors and Materials
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is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.
Instructions to authors
English 日本語
Instructions for manuscript preparation
English 日本語
Template
English
Publisher
MYU K.K.
Sensors and Materials
1-23-3-303 Sendagi,
Bunkyo-ku, Tokyo 113-0022, Japan
Tel: 81-3-3827-8549
Fax: 81-3-3827-8547
MYU Research, a scientific publisher, seeks a native English-speaking proofreader with a scientific background. B.Sc. or higher degree is desirable. In-office position; work hours negotiable. Call 03-3827-8549 for further information.
MYU Research
(proofreading and recording)
MYU K.K.
(translation service)
The Art of Writing Scientific Papers
(How to write scientific papers)
(Japanese Only)
Sensors and Materials, Volume 17, Number 5 (2005)
Copyright(C) MYU K.K.
Copyright(C) MYU K.K.
|
pp. 227-236
S&M601 Research Paper of Special Issue Published: 2005 A Wafer Level Lateral Bonding Scheme with a LEGO-Like Structure [PDF] Eunsung Lee, Woonbae Kim, Insang Song, Changyoul Moon, Hyeon Cheol Kim, Moon Koo Kang, Soon-Don Choi and Kukjin Chun (Received August 21, 2004; Accepted December 6, 2004) Keywords: wafer level packaging (WLP), solder, hermeticity, interconnection, lateral bonding
A wafer level lateral bonding scheme is presented as an alternative to MEMS packag- ing applications. The proof-of-concept structure is fabricated and evaluated to confirm the feasibility of the new scheme. The most distinct difference between this new scheme and conventional ones is that wafers are laterally bonded by solder reflow with a new apparatus. This lateral bonding scheme has merits in that it is morphologically insensitive and enables not only hermetic sealing but also electrical via-interconnection. Bonding strength is evaluated under shear and the hermeticity of encapsulation is examined using the pressurized helium leak detection method based on MIL-STD 883E. Results show that the new scheme is feasible as an alternative method for high-yield wafer level packaging.
Corresponding author: Eunsung Lee Cite this article Eunsung Lee, Woonbae Kim, Insang Song, Changyoul Moon, Hyeon Cheol Kim, Moon Koo Kang, Soon-Don Choi and Kukjin Chun, A Wafer Level Lateral Bonding Scheme with a LEGO-Like Structure, Sens. Mater., Vol. 17, No. 5, 2005, p. 227-236. |
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Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Cheng-Fu Yang (National University of Kaohsiung)
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Special Issue on Advanced Micro/Nanomaterials for Various Sensor Applications (Selected Papers from ICASI 2024)
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- Deep Learning Prediction Model of Mortality Including Brain-type Natriuretic Peptide in Patients with Acute Decompensated Heart Failure
Hirotaka Takizawa, Masatoshi Minamisawa, Hirohiko Motoki, Koichiro Kuwahara, and Masaki Yamaguchi
- Deep Learning Prediction Model of Mortality Including Brain-type Natriuretic Peptide in Patients with Acute Decompensated Heart Failure
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