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Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
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Sensors and Materials, Volume 17, Number 5 (2005)
Copyright(C) MYU K.K.
pp. 227-236
S&M601 Research Paper of Special Issue
Published: 2005

A Wafer Level Lateral Bonding Scheme with a LEGO-Like Structure [PDF]

Eunsung Lee, Woonbae Kim, Insang Song, Changyoul Moon, Hyeon Cheol Kim, Moon Koo Kang, Soon-Don Choi and Kukjin Chun

(Received August 21, 2004; Accepted December 6, 2004)

Keywords: wafer level packaging (WLP), solder, hermeticity, interconnection, lateral bonding

A wafer level lateral bonding scheme is presented as an alternative to MEMS packag- ing applications. The proof-of-concept structure is fabricated and evaluated to confirm the feasibility of the new scheme. The most distinct difference between this new scheme and conventional ones is that wafers are laterally bonded by solder reflow with a new apparatus. This lateral bonding scheme has merits in that it is morphologically insensitive and enables not only hermetic sealing but also electrical via-interconnection. Bonding strength is evaluated under shear and the hermeticity of encapsulation is examined using the pressurized helium leak detection method based on MIL-STD 883E. Results show that the new scheme is feasible as an alternative method for high-yield wafer level packaging.

Corresponding author: Eunsung Lee


Cite this article
Eunsung Lee, Woonbae Kim, Insang Song, Changyoul Moon, Hyeon Cheol Kim, Moon Koo Kang, Soon-Don Choi and Kukjin Chun, A Wafer Level Lateral Bonding Scheme with a LEGO-Like Structure, Sens. Mater., Vol. 17, No. 5, 2005, p. 227-236.



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