To improve product quality and ensure process stability, high standards are required for automated dual-liquid potting, aiming to quantitatively evaluate its process capability and enhance quality control and consistency during mass production. In this study, we focus on improving the potting and encapsulation process for electronic products. The process involves mixing a base agent (epoxy resin) with a curing agent (amine resin) in a specific ratio. The mixture is injected into products containing electronic components and circuitry using automated equipment or manual operation. After curing at room temperature or with heating, an insulating protective layer is formed, providing adhesion and sealing functions. During this process, unfavorable environmental conditions or component malfunctions may lead to process failures, resulting in a high defect rate, increased production costs, and negative impact on overall output. The goal of this study is to enhance equipment stability and implement preventive strategies to ensure optimal operating conditions. After the system was implemented, the number of defective products was successfully reduced to within 10%, achieving stable production quality. A programmable logic controller was used in conjunction with communication protocols such as RS-485, Ethernet/IP, and MODBUS to collect key process parameters such as pressure, temperature, and flow rate, which directly affect product quality and allow the real-time monitoring of both product and equipment status. Furthermore, three-way ANOVA was used to simulate different operational scenarios (normal, upper limit, lower limit, and abnormal conditions) to evaluate the impact of each factor on process stability, mixing quality, and product reliability. Through data analysis, standard procedures were developed for routine maintenance, preventive servicing, and the prediction of remaining equipment life, with the aim of improving production efficiency and reducing defect rate.