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Notice of retraction
Vol. 34, No. 8(3), S&M3042

Notice of retraction
Vol. 32, No. 8(2), S&M2292

Print: ISSN 0914-4935
Online: ISSN 2435-0869
Sensors and Materials
is an international peer-reviewed open access journal to provide a forum for researchers working in multidisciplinary fields of sensing technology.
Sensors and Materials
is covered by Science Citation Index Expanded (Clarivate Analytics), Scopus (Elsevier), and other databases.

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 Sensors and Materials
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Vol. 30 No. 4(1)
Special Issue on Open Collaboration for MEMS

Guest Editor: Masayoshi Esashi (Tohoku University)

Preface

  • Micro-electromechanical systems (MEMS) has been developed for sensors and other systems since 1971 at Tohoku University. Ion-sensitive FET (ISFET) probes made by micromachining were commercializ ... Read More

  • In this paper, “Open Collaboration” is defined as research and development (R&D) in a value/supply chain composed of different organizations including companies, universities and research ins ... Read More

  • The hands-on-access fabrication facility for MEMS at Tohoku University is an open facility for every engineer working to develop MEMS devices. The fab is located at Jun-ichi Nishizawa Memorial R ... Read More

  • In this paper, the technology and business activities of MEMS-CORE, which was established in 2001 as a venture company of Tohoku University, will be reviewed. MEMS-CORE is successfully maintaini ... Read More

  • The Trillion Sensors (TSensors) Initiative was started in 2013 in the US alongside the global economic tide of the Internet of things (IoT) to pursue a society in which trillion sensors are conne ... Read More

  • In this paper, we summarize research activities and technology progress in the field of current CMOS-MEMS resonators and oscillators for the portable sensor node and timing applications. By emplo ... Read More

  • Gas sensors based on resonant microcantilevers have drawn significant attention in the application of trace molecule detection. In order to realize the practical application of microcantilever-b ... Read More

  • More and more smart components and smart integrated systems enter into diverse innovative products and applications. They are key components and key technologies for industry 4.0 as well as Inte ... Read More

  • New MEMS devices are usually invented by academics having a goal of advancing technology and knowledge in their field. Along the way, market opportunities are often found, and then a new goal ar ... Read More


S&M1530

30th Commemorative Article

S&M1530
Wafer-level Packaging, Equipment Made in House, and Heterogeneous Integration
Masayoshi Esashi
pp. 683-691
https://doi.org/10.18494/SAM.2018.1638
Published on April 13, 2018
PDF (open access)

S&M1531

Perspective of Special Issue

S&M1531
Faster and More Cost-Effective Way to Success in MEMS R&D by Open Collaboration in Tohoku University
Shuji Tanaka
pp. 693-699
https://doi.org/10.18494/SAM.2018.1914
Published on April 13, 2018
PDF (open access)

S&M1532

Perspective of Special Issue

S&M1532
Accelerating MEMS Development by Open Collaboration at Hands-On-Access Fab, Tohoku University
Kentaro Totsu, Masaaki Moriyama, Yukio Suzuki, and Masayoshi Esashi
pp. 701-711
https://doi.org/10.18494/SAM.2018.1804
Published on April 13, 2018
PDF (open access)

S&M1533

Perspective of Special Issue

S&M1533
Development Services of MEMS-CORE
Koji Homma
pp. 713-722
https://doi.org/10.18494/SAM.2018.1799
Published on April 13, 2018
PDF (open access)

S&M1534

Perspective of Special Issue

S&M1534
Trillion Sensors and MEMS
Susumu Kaminaga
pp. 723-731
https://doi.org/10.18494/SAM.2018.1814
Published on April 13, 2018
PDF (open access)

S&M1535

Review Paper of Special Issue

S&M1535
CMOS-MEMS Resonators and Oscillators : A Review
Chao-Yu Chen, Ming-Huang Li, and Sheng-Shian Li
pp. 733-756
https://doi.org/10.18494/SAM.2018.1857
Published on April 13, 2018
PDF (open access)

S&M1536

Research Paper of Special Issue

S&M1536
Gas Sensing System Composed of IC-Foundry-Compatible Microcantilever, Advanced Sensing Material, and Intelligent Signal Processing
Xin Peng, Yanqing Lv, Pengcheng Xu, Xinxin Li, Haitao Yu, and Jiaqiang Xu
pp. 757-766
https://doi.org/10.18494/SAM.2018.1798
Published on April 13, 2018
PDF (open access)

S&M1537

Review Paper of Special Issue

S&M1537
Integrated Microsystems for Smart Applications
Thomas Otto, Steffen Kurth, Sven Voigt, Andreas Morschhauser, Marco Meinig, Karla Hiller, Joerg Martin, and Martina Vogel
pp. 767-778
https://doi.org/10.18494/SAM.2018.1797
Published on April 13, 2018
PDF (open access)

S&M1538

Perspective of Special Issue

S&M1538
Translational Engineering: Best Practices in Developing MEMS for Volume Manufacturing
Alissa M. Fitzgerald, Keith M. Jackson, Charles C. Chung, and Carolyn D. White
pp. 779-789
https://doi.org/10.18494/SAM.2018.1843
Published on April 13, 2018
PDF (open access)

Cover of this Issue





Forthcoming Regular Issues


Forthcoming Special Issues

Special Issue on Applications of Novel Sensors and Related Technologies for Internet of Things
Guest editor, Teen-Hang Meen (National Formosa University), Wenbing Zhao (Cleveland State University), and Cheng-Fu Yang (National University of Kaohsiung)
Call for paper


Special Issue on Advanced Sensing Technologies for Green Energy
Guest editor, Yong Zhu (Griffith University)
Call for paper


Special Issue on Room-temperature-operation Solid-state Radiation Detectors
Guest editor, Toru Aoki (Shizuoka University)
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Special Issue on International Conference on Biosensors, Bioelectronics, Biomedical Devices, BioMEMS/NEMS and Applications 2023 (Bio4Apps 2023)
Guest editor, Dzung Viet Dao (Griffith University) and Cong Thanh Nguyen (Griffith University)
Conference website
Call for paper


Special Issue on Advanced Sensing Technologies and Their Applications in Human/Animal Activity Recognition and Behavior Understanding
Guest editor, Kaori Fujinami (Tokyo University of Agriculture and Technology)
Call for paper


Special Issue on Signal Collection, Processing, and System Integration in Automation Applications
Guest editor, Hsiung-Cheng Lin (National Chin-Yi University of Technology)
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