Vol. 30 No. 4(1)
Special Issue on Open Collaboration for MEMS
Guest Editor: Masayoshi Esashi (Tohoku University)
Micro-electromechanical systems (MEMS) has been developed for sensors and other systems since 1971 at Tohoku University. Ion-sensitive FET (ISFET) probes made by micromachining were commercializ ... Read More
In this paper, “Open Collaboration” is defined as research and development (R&D) in a value/supply chain composed of different organizations including companies, universities and research ins ... Read More
The hands-on-access fabrication facility for MEMS at Tohoku University is an open facility for every engineer working to develop MEMS devices. The fab is located at Jun-ichi Nishizawa Memorial R ... Read More
In this paper, the technology and business activities of MEMS-CORE, which was established in 2001 as a venture company of Tohoku University, will be reviewed. MEMS-CORE is successfully maintaini ... Read More
The Trillion Sensors (TSensors) Initiative was started in 2013 in the US alongside the global economic tide of the Internet of things (IoT) to pursue a society in which trillion sensors are conne ... Read More
In this paper, we summarize research activities and technology progress in the field of current CMOS-MEMS resonators and oscillators for the portable sensor node and timing applications. By emplo ... Read More
Gas sensors based on resonant microcantilevers have drawn significant attention in the application of trace molecule detection. In order to realize the practical application of microcantilever-b ... Read More
More and more smart components and smart integrated systems enter into diverse innovative products and applications. They are key components and key technologies for industry 4.0 as well as Inte ... Read More
New MEMS devices are usually invented by academics having a goal of advancing technology and knowledge in their field. Along the way, market opportunities are often found, and then a new goal ar ... Read More
S&M153030th Commemorative Article |
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S&M1530 Wafer-level Packaging, Equipment Made in House, and Heterogeneous Integration Masayoshi Esashi pp. 683-691 https://doi.org/10.18494/SAM.2018.1638 Published on April 13, 2018 PDF (open access) |
S&M1531Perspective of Special Issue |
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S&M1531 Faster and More Cost-Effective Way to Success in MEMS R&D by Open Collaboration in Tohoku University Shuji Tanaka pp. 693-699 https://doi.org/10.18494/SAM.2018.1914 Published on April 13, 2018 PDF (open access) |
S&M1532Perspective of Special Issue |
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S&M1532 Accelerating MEMS Development by Open Collaboration at Hands-On-Access Fab, Tohoku University Kentaro Totsu, Masaaki Moriyama, Yukio Suzuki, and Masayoshi Esashi pp. 701-711 https://doi.org/10.18494/SAM.2018.1804 Published on April 13, 2018 PDF (open access) |
S&M1533Perspective of Special Issue |
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S&M1533 Development Services of MEMS-CORE Koji Homma pp. 713-722 https://doi.org/10.18494/SAM.2018.1799 Published on April 13, 2018 PDF (open access) |
S&M1534Perspective of Special Issue |
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S&M1534 Trillion Sensors and MEMS Susumu Kaminaga pp. 723-731 https://doi.org/10.18494/SAM.2018.1814 Published on April 13, 2018 PDF (open access) |
S&M1535Review Paper of Special Issue |
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S&M1535 CMOS-MEMS Resonators and Oscillators : A Review Chao-Yu Chen, Ming-Huang Li, and Sheng-Shian Li pp. 733-756 https://doi.org/10.18494/SAM.2018.1857 Published on April 13, 2018 PDF (open access) |
S&M1536Research Paper of Special Issue |
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S&M1536 Gas Sensing System Composed of IC-Foundry-Compatible Microcantilever, Advanced Sensing Material, and Intelligent Signal Processing Xin Peng, Yanqing Lv, Pengcheng Xu, Xinxin Li, Haitao Yu, and Jiaqiang Xu pp. 757-766 https://doi.org/10.18494/SAM.2018.1798 Published on April 13, 2018 PDF (open access) |
S&M1537Review Paper of Special Issue |
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S&M1537 Integrated Microsystems for Smart Applications Thomas Otto, Steffen Kurth, Sven Voigt, Andreas Morschhauser, Marco Meinig, Karla Hiller, Joerg Martin, and Martina Vogel pp. 767-778 https://doi.org/10.18494/SAM.2018.1797 Published on April 13, 2018 PDF (open access) |
S&M1538Perspective of Special Issue |
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S&M1538 Translational Engineering: Best Practices in Developing MEMS for Volume Manufacturing Alissa M. Fitzgerald, Keith M. Jackson, Charles C. Chung, and Carolyn D. White pp. 779-789 https://doi.org/10.18494/SAM.2018.1843 Published on April 13, 2018 PDF (open access) |
Cover of this Issue |
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